DOI QR코드

DOI QR Code

The Coupled Electro-Thermal Field Analysis for Predicting Over-Current Protector Behavior

  • Bae, Jae-Nam (Department of Electrical Engineering, Hanyang University) ;
  • Lee, Sung-Gu (Department of Electrical Engineering, Hanyang University) ;
  • Han, Jung-Ho (Department of Physics Physical Science, Soonchunhyang University) ;
  • Chung, Hae-Yang (Department of Electrical Engineering, Soonchunhyang University) ;
  • Lee, Ju (Department of Electrical Engineering, Hanyang University)
  • 발행 : 2008.07.31

초록

The characteristics of heat transfer of the bimetal disc for over-current protection device is specified. Bimetal consists of two metals which have a different thermal expansion coefficient. To analyze the thermal characteristics, temperature distribution when bimetal acts as a switch is calculated. As usual, heat source is applied to the bimetal and electric current is heat source in the over-current protection switch. In this paper, thermal distribution are obtained by solving a coupled electro-thermal field with 3D finite element method.

키워드

참고문헌

  1. Ansoft cooperation, "Maxwell online help - Maxwell 3D technical notes", Version 12.0, 2008
  2. Ansoft cooperation, "ePhysics online help - ePhysics technical notes", Version 2.0, 2006
  3. R. J. Smith, "Circuits, Devices, and Systems, 2nd ed." New York: Wiley, 1984
  4. Douglas J. Nelson and J. Patrick Jessee, "A Coupled Thermal Magnetic Model for High Frequency Transformers: Part I - Model Formulation and Material Properties", IEEE Transactions on components hybrids, and manufacturing technology, Vol. 15, No. 5, October 1992, pp.730-739 https://doi.org/10.1109/33.180037
  5. Douglas J. Nelson and J. Patrick Jessee, "A Coupled Thermal Magnetic Model for High Frequency Transformers: Part I1 -Finite Element Implementation and Validation", IEEE Transactions on components hybrids, and manufacturing technology, Vol. 15, No. 5, October 1992, pp.740-747 https://doi.org/10.1109/33.180038
  6. Eugeniusz Kurgan, "Analysis of Coupled Electric and Thermal Field Problems by Boundary-Element Method", IEEE Transactions on Magnetics, Vol. 38, No. 2, March 2002, pp.949-952 https://doi.org/10.1109/20.996244