References
- Y. H Chen, J. R. Lin, S. Chen, C. T. Ko, T. Y. Kuo, C. W. Chien, S. P. Yu, A. Ostmann and A. Neumann, in proceedings of the Electronics Packaging Technology Conf. (Singapore, 2004) p.595
- C. T. Ko, S. Chen, C. W. Chiang, T. Y. Kuo, Y. C. Shih and Y. H. Chen, in proceedings of the Electronic Components and Technology Conf. (Nevada, USA, 2004) p.322
- T. Loher, A. Neumann, L. Bottcher, A. Pahl, A. Ostmann, R. Aschenbrenner and H. Reichl, International Conference on Electronics Packaging Technology (Shenzhen, China, 2005) p.287 https://doi.org/10.1109/ICEPT.2005.1564633
- S. C. Park, J. H. Lee, J. W. Lee, I. H. Lee, S. E. Lee, B. I. Song, Y. K. Chung and Y. B. Park, J. Microelectronics & Packaging Society, 14(1), 61 (2007)
- K. J. Min, S. C. Park, J. J. Lee, K. H. Lee, G. H Lee and Y. B. Park, Journal of the Microelectronics & Packaging Society, 14(1), 39 (2007)
- Y. X. Liu, E. T. Kang, K. G. Neoh, J. F. Zhang, C. Q. Cui and T. B. Lim, IEEE Trans. Adv. Packag., 22(2), 214 (1999) https://doi.org/10.1109/6040.763194
- B. I. Noh, C. S. Seok, W. C. Moon and S. B. Jung, Int. J. Adhes. Adhes., 27(3), 200 (2007) https://doi.org/10.1016/j.ijadhadh.2006.03.005
- S. C. Park, S. H. Cho, H. C. Jung, J. W. Joung and Y. B. Park, Kor. J. Mater. Res., 17(4), 215 (2007) https://doi.org/10.3740/MRSK.2007.17.4.215
- J. Shang and Y. I. Liu, Circuit World, 29(4), 28 (2003) https://doi.org/10.1108/03056120310478550
- R. P. Prasad, Surface Mount Technology: Principles and Practice, 3rd ed., p.129, Van Nostrand Reinhold, New York, USA (1989)
- J. Y. Song and J. Yu, Acta Mater., 50(16), 3985 (2002) https://doi.org/10.1016/S1359-6454(02)00197-0
- K. S. Kim and N. Aravas, Int. J. Solid. Struct., 24(4), 417 (1988) https://doi.org/10.1016/0020-7683(88)90071-6
- S. C. Park, K. J. Min, K. H. Lee, Y. S. Jeong and Y. B. Park, Kor. J. Mater. Res., 18(9), 486 (2008) https://doi.org/10.3740/MRSK.2008.18.9.486
- A. J. Kinloch, C. C. Lau and J. G. Williams, Int. J. Fract., 66(1), 45 (1994) https://doi.org/10.1007/BF00012635
- J. Y. Park, Y. S. Jung, J. Cho and W. K. Choi, Appl. Surf. Sci., 252(16), 5877 (2006) https://doi.org/10.1016/j.apsusc.2005.08.019
- W. J. Lee and Y. B. Kim, Thin Solid Films, 517(3), 1191 (2008) https://doi.org/10.1016/j.tsf.2008.06.022
- K. J. Min, S. C. Park, K. W. Lee, J. D. Kim, D. G. Kim, G. H. Lee and Y. B. Park, J. Kor. Inst. Met. & Mater., 47(1), 26 (2009)
- S. H. Kim, S. H. Cho, N. E. Lee, H. M. Kim, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol., 193(1-3), 101 (2005) https://doi.org/10.1016/j.surfcoat.2004.08.130
- M. H. Kim and K. W. Lee, Met. Mater. Int., 12(5), 425 (2006) https://doi.org/10.1007/BF03027710
- Z. WANG, F. Akihiko, Y. Keiichirou, I. Hideo, B. Tomoyuki, H. Muneaki, T. Sotaro, S. Shoso, K. Hiroshi and O. Tadahiro, J. Adhes. Sci. Tech., 16(8), 1027 (2002) https://doi.org/10.1163/156856102760146147
- V. Zaporojtchenko, J. Zekonyte, S. Wille, U. Schuermann and F. Faupel, Nucl. Inst. and Meth., in Phys. Res., B 236(1-4), 95 (2005) https://doi.org/10.1016/j.nimb.2005.03.261
- S. Ikeda, H. Yanagimoto, K. Akamatsu and H. Nawafune, Adv. Funct. Mater., 17, 889 (2007) https://doi.org/10.1002/adfm.200600527