Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Introduction of TSV (Through Silicon Via) Technology

TSV (Through Silicon Via) 기술 동향

  • Published : 2009.03.30
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Abstract

Keywords

References

  1. S. F. Al-sarawi, D. Abbott, and P. D. Franzon : IEEE Transactions CPMT-part B, 21, 2 (1998).
  2. Nikkei Electronics, (2007. 1. 15).
  3. 2007 3D IC Yole report, Yole development, Fr., (2007).
  4. 2008 3D TSV Interconnects Yole report, Yole development, Fr., (2008).
  5. 전자신문, 2006년 4월 14일.
  6. 중앙일보, 2007년 4월 23일.