Development of New Electroplating Alloy (Au-Cu) for Increasing the Durability of PCB Commutator in Vibration Motor

진동모터용 PCB 정류자의 내구성 향상을 위한 신 합금도금 (Au-Cu) 개발

  • Kim, Young-Tae (MD Division, Samsung Electro-Mechanics Co.) ;
  • Lee, Sung-Jae (Central R&D Institute, Samsung Electro-Mechanics Co.) ;
  • Park, Sung-Jun (Department of Mechanical Engineering, Chungju National Univ.)
  • 김영태 (삼성전기 MD 사업팀 MD 개발 1G) ;
  • 이성재 (삼성전기 중앙연구소 분석 G) ;
  • 박성준 (충주대학교 기계공학과)
  • Published : 2009.06.01

Abstract

Mobile phone is a representative personal communication tool among wireless communication devices. Recently, with the miniaturization and light-weight trend of mobile phone, the vibration motor has been replaced by coin type. The required performances of coin type vibration motor needed by user are long life, higher vibration, and thin thickness. Also the most important factor determines the performance of vibration motor is long-term reliability, which is mainly related to PCB plating technique for commutator. In this study, three types of fault were categorized to analyze the cause for malfunction of vibration motor. And, hardness and surface morphology on plating surface are also investigated to optimize the plating method and plating conditions. As a result, new plating method and conditions were proposed to increase the durability of PCB commutator.

Keywords

References

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