Abstract
Unstable sustain discharges can occur at the bottom cells of the panel at high temperature. To solve this problem, the wall charge variation during an address period was investigated. A test panel of 7.5 inch XGA level was used and one green cell was measured. In order to realize operating condition equal to that of the bottom cells of 50 inch panel, the addressing stress pulses are applied. It seems that the resultant wall charge loss during address period increased with increase of stress time, temperature, pressure and Xe %. Wall charge loss increases with potential difference between scan electrode and address electrode, therefore wall charge loss can be minimized by the increase of scan voltage during address period.
