Flow Distribution and Heat Transfer Characteristic of the Microchannel Waterblock with Different Shape of Inlet

미세채널 워터블록의 유입부 형상에 따른 유량분배 및 열유동 특성

  • Choi, Mi-Jin (Energy System Technology Center, Korea Institute of Industrial Technology) ;
  • Kwon, Oh-Kyung (Energy System Technology Center, Korea Institute of Industrial Technology) ;
  • Yun, Jae-Ho (Energy System Technology Center, Korea Institute of Industrial Technology)
  • 최미진 (한국생산기술연구원 에너지설비기술지원센터) ;
  • 권오경 (한국생산기술연구원 에너지설비기술지원센터) ;
  • 윤재호 (한국생산기술연구원 에너지설비기술지원센터)
  • Published : 2009.07.10

Abstract

The present study has been studied on a thermal and flow characteristic of the microchannel waterblock with flow distributions in each channels. Results of a numerical analysis using the CFX-11 are compared with results of an experiment. Numerical analysis and experiment are conducted under an input power of 150 W, inlet temperature of $20^{\circ}C$ and mass flow rates of $0.7{\sim}2.0$ kg/min. Base temperature and pressure drop are investigated with standard deviations of mass flow rates in each channels of samples. The flow distribution and j/f factor of the sample 4 is increased by about 65.7% and 42.6%, compared to that of the reference model sample 3.

Keywords

References

  1. Pecht, M., 1990, Handbook of Electronics Package Design, Marcel Dekker, Inc. pp. 40-43
  2. Pastukhov, V. G., Maidanik, Yu. F., Vershinin, C. V., Korukov, M. A., 2003, Miniature loop heat pipes for electronics cooling, Applied Thermal Engineering, Vol. 23, No. 10, pp. 1125-1135 https://doi.org/10.1016/S1359-4311(03)00046-2
  3. Yasushi, K., Hideaki, I., Masataka, M., Yuji, S., Shuichi, T., 2006, Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber, Applied Thermal Engineering, Vol. 26, No. 14-15, pp. 1669-1676 https://doi.org/10.1016/j.applthermaleng.2005.11.012
  4. Pastukhov, V. G., Maydanik, Y. F., 2007, Lownoise cooling system for PC on the base of loop heat pipes, Applied Thermal Engineering, Vol. 27, No. 5-6, pp. 894-901 https://doi.org/10.1016/j.applthermaleng.2006.09.003
  5. Incropera, F. P., 1999, Liquid Cooling of Electronic Devices by Single-phase Convection, Wiley, New York, pp. 151-153
  6. Steinberg, D. S., 1991, Cooling Techniques for Electronic Equipment, Wiley, New York, pp. 371-372
  7. Kim, M. S., Lee, K. S., 2006, Performance analysis on a multi-pass multi-branch heat exchanger according to pass arrangement, Trans. of the KSME B, Vol. 30, No. 8, pp. 741-748 https://doi.org/10.3795/KSME-B.2006.30.8.741
  8. Kwon, O. K., Choi, M. J., Cha, D. A., Yun, J. H., 2008, A study on thermal performance of micro channel waterblock for computer CPU cooling, Trans. of the KSME B, Vol. 32, No. 10, pp. 776-783 https://doi.org/10.3795/KSME-B.2008.32.10.776
  9. Kwon, O. K., Choi, M. J., Cha, D. A., Yun, J. H., 2007, A Numerical analysis on the cooling performance of microchannel waterblock for computer CPU cooling, Journal of Industrial Technology, Vol. 17, No. 4, pp. 176-187