한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제18권5호
  • /
  • Pages.449-454
  • /
  • 2009
  • /
  • 2508-5093(pISSN)
  • /
  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
권호 표지

Sn-xAg-0.5Cu 무연 솔더의 파손특성에 관한 실험적 연구

An Experimental Study on the Failure Characteristics of Sn-xAg-0.5Cu Lead-free Solder

  • 정종설 (서울산업대 NID 융합기술전문대학원) ;
  • 이용성 (서울산업대 NID 융합기술전문대학원) ;
  • 신기훈 (서울산업대 기계공학과) ;
  • 정성균 (서울산업대 기계공학과) ;
  • 김종형 (서울산업대 기계설계자동화공학부) ;
  • 장동영 (서울산업대 산업정보시스템공학과)
  • 발행 : 2009.10.15
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초록

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

키워드

참고문헌

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