Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지

Utilization of Carbon Nanotubes for New Interconnect Materials in Electronic Packaging

전자 패키징 Interconnect 소재로의 카본 나노튜브의 활용

  • 이종현 (서울산업대학교 신소재공학과)
  • Published : 2009.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

Carbon nanotube(CNT)s have been considered as one of the most unique materials due to the their superior mechanical, thermal and electrical properties. Therefore, numerous studies have been performed for the utilization of CNTs. This review article focuses on the recent research trends on the utilization of CNTs for new interconnect materials in electronics packaging. Major contents mentioned are the direct interconnection technology using CNTs and the main properties of polymer/CNTs composite materials. This article is aimed at the reviewing of important results from the recent studies and providing the straightforward understanding of the results through the mutual analysis and a industrial viewpoint.

Keywords

References

  1. S. Iijima, "Helical Microtubules of Graphic Carbon", Nature, 354, 56 (1991). https://doi.org/10.1038/354056a0
  2. P. M. Ajayan, "Nanotubes from Carbon", Chem. Rev., 99(1), 1787-1799 (1999). https://doi.org/10.1021/cr970102g
  3. M. -F. Yu, B. S. Files, S. Arepalli, and R. S. Ruoff, "Tensile Loading of Ropes of Single Wall Carbon Nanotubes and Their Mechanical Properties", Phys. Rev. Lett., 84(24), 5552-5555 (2000). https://doi.org/10.1103/PhysRevLett.84.5552
  4. B. G. Demczyk, Y. M. Yang, J. Cumings, M. Hatman, W. Han, A. Zettl, and R. O. Ritchie, "Direct Mechanical Measurement of the Tensile Strength and Elastic Modulus of Multiwalled Carbon Nanotubes", Mater. Sci. Eng. A, 334, 173-178 (2002). https://doi.org/10.1016/S0921-5093(01)01807-X
  5. Y. Yosida, "High Temperature Shrinkage of Single-walled Carbon Nanotube Bundles up to 1600K", J. Appl. Phys., 87, 3338-3341 (2000). https://doi.org/10.1063/1.372345
  6. S. Berber, Y. K. Kwon, D. Tomanek, "Unusually Thermal Conductive of Carbon Nanotubes", Phys. Rev. Lett., 84(20), 4613-4616 (2000). https://doi.org/10.1103/PhysRevLett.84.4613
  7. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, Phys. Rev. Lett, 87, 215502 (2001). https://doi.org/10.1103/PhysRevLett.87.215502
  8. A. Thess, R. Lee, P. Nikolaev, H. Dai, P. Petit, J. Robert, C. Xu, Y. H. Lee, S. G. Kim, A. G. Rinzler, D. T. Colbert, G Scuseria, D. Tomanek, J. E. Fischer, and R. E. Smalley, "Crystalline Ropes of Metallic Carbon Nanotubes", Science, 273, 483 (1996). https://doi.org/10.1126/science.273.5274.483
  9. M. Heimann, J. Lemm, and K. -J. Wolter, "Characterization of Carbon Nanotubes/Epoxy Composites for Electronics Applications", Proc. of 30th ISSE, 1-6 (2007).
  10. The International Technology Roadmap for Semiconduc-tors(ITIS) Report: Assembly and Packaging, 2007 Edition (2007).
  11. Y. Li and C. P. Wong, "Recent Advance of Conductive Adhe-sives as a Lead-free Alternative in Electronic Packaging: Materials, Processing Reliability and Application", Mater. Sci. Eng. R, 51, 1-35 (2006). https://doi.org/10.1016/j.mser.2006.01.001
  12. W. Lin, Y. Xiu, L. Zhu, K. -S. Moon, and C. P. Wong, "Assembling of Carbon Nanotube Structures by Chemical Anchoring for Packaging Applications", Proc. of 58th ECTC, 421-426 (2008).
  13. L. Zhu, K. -S. Moon, B. Bertram, D. W. Hess, and C. P. Wong, "Fine-pitch Carbon Nanotube Bundles Assembly Using CNT Transfer for Electronic Interconnects", Proc. of 58th ECTC, 309-313 (2008).
  14. K. P. Yung, J. Wei, and B. K. Tay, "Formation and Assembly of Carbon Nanotube Bumps for Interconnection Applications", Diam. Relat. Mater, 18, 1109-1113 (2009). https://doi.org/10.1016/j.diamond.2009.02.022
  15. T. Y. Tsai, C. Y. Lee, N. H. Tai, and W. H. Tuan, "Transfer of Patterned Vertically Aligned Carbon Nanotubes onto Plastic Substrates for Flexible Electronics and Field Emission Devices", Appl. Phys. Lett., 95, 013107-1 (2009). https://doi.org/10.1063/1.3167775
  16. M. Meyyappan, Carbon Nanotubes Science and Application, CRC Press, FL (2005).
  17. W. Hnlein "New Prospects for Microelectronics: Carbon Nanotubes", Jpn. J. App. Phys., 41(6B), 4370-4374 (2002). https://doi.org/10.1143/JJAP.41.4370
  18. A. M. B. Bara, "Polymer/CNT Composites for Electronic Packaging", Proc. of ESTC 2006, 334-336 (2006).
  19. D. -Q. Yang, J. -F. Rochette, and E. Sacher, "Functionalization of Multiwalled Carbon Nano Tubes by Mild Aqueous Soni-fication", J. Phys. Chem. B, 109, 7788-7794 (2005). https://doi.org/10.1021/jp045147h
  20. M. Heimann, M. Wirts-Ruetters, B. Bohhme, and K. -J. Wolter, "Investigation of Carbon Nanotubes Epoxy Composites for Electronics Packaging", Proc. of 58th ECTC, 1731-1736 (2008).
  21. M. Wirts-Rutters, M. Heimann, Jana Kolbe, and K. -J. Wolter, "Carbon Nanotube(CNT) Filled Adhesives for Microelectronic Packaging", Proc. of 2nd ESTC, 1057-1062 (2008).
  22. M. B. Bryming, D. E. Milkie, M.F. Islam, J.M. Kikkawa, and A.G. Yodh, "Thermal Conductivity and Interfacial Resistance in Single-wall Carbon Nanotube Epoxy Composites", Appl. Phys. Lett, 87, 161909-1 (2005). https://doi.org/10.1063/1.2103398
  23. F. H. Gojny, M. G. Wichmann, B. Fiedler, I. A. Kinloch, W. Bauhofer, A. H. Windle, and K. Schutle, "Evaluation and Identification of Electrical and Thermal Conduction Mechanism in Carbon Nanotube/epoxy Composites", Polymer, 47, 2036-2045 (2006). https://doi.org/10.1016/j.polymer.2006.01.029
  24. A. Moisala, Q. Li, I. A. Kionloch, and A. H. Windle, "Thermal and Electrical Conductivity of Single- and Multi-walled Carbon Nanotube-epoxy Composites", Comp. Sci. Tech, 66, 1285-1288 (2006). https://doi.org/10.1016/j.compscitech.2005.10.016
  25. K. -S. Moon, W. Lin, H. Jiang, H. Ko, L. Zhu, and C. P. Wong, "Surface Treatment of MWCNT Array and Its Polymer Composites for TIM Application", Proc. of 58th ECTC, 234-237 (2008).
  26. B. T. Wang, C. -H. Lei, A. B. Dalton, C. Creton, Y. Kin, K. A. S. Fernando, Y. -P. Sun, M. Manea, J. M. Asua, and J. L. Keddie, "Waterborne, Nanocomposite Pressure-Sensitive Adhesives with High Tack Energy, Optical Transparency, and Electrical Conductivity", Adv. Mater, 18, 2730-2734 (2006). https://doi.org/10.1002/adma.200601335
  27. K. Mantena, J. Li, and J. K. Lumpp, "Electrically Conductive Carbon Nanotube Adhesives on Lead Free Printed Circuit Board Surface Finishes", Proc. of IEEE Aerospace Conference, 1-5 (2008).
  28. H. Jiang, M. J. Yim, K. -S. Moon, and C. P. Wong, "Novel Nonconductive Adhesives/Films with Carbon Nanotubes for High Performance Interconnects", Proc. of 58th ECTC, 1385-1389 (2008).
  29. M. Mooney, "The Viscosity of a Concentrated Suspension of Spherical Particles", J. Colloid. Sci., 6, 162-170 (1951). https://doi.org/10.1016/0095-8522(51)90036-0
  30. J. Liu, M. O. Olorunyomi, X. Lu, W. X. Wang, T. Aronsson, and D. Shangguan, "New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging", Proc. of 56th ECTC, 1-6 (2006).
  31. H. P. Wu, X. J. Wu, M. Y. Ge, G. Q. Zhang, Y. W. Wang, and J. Jiang, "Properties Investigation on Isotropical Conductive Adhesives Filled with Silver Coated Carbon Nanotubes", Comp. Sci. Tech., 67, 1182-1186 (2007). https://doi.org/10.1016/j.compscitech.2006.05.010
  32. Z. Wu, J. Li, D. Timmer, K. Lozano, and S. Bose, "Study of Processing Variables on the Electrical Resistivity of Conductive Adhesives", Int. J. Adhes Adhes, 29, 488-494 (2009). https://doi.org/10.1016/j.ijadhadh.2008.10.003
  33. Z. Zhang, S. Jiang, J. Liu, and M. Inoue, "Development of High Temperature Stable Isotropic Conductive Adhesives", Proc. of ICEPT-HDP, 1-5, 2008 (2008).
  34. H. -H. Lee, K. -S. Chou, and Z. -W. Shih, "Effect of Nano-sized Silver Particles on the Resistivity of Polymeric Conductive Adhesives", Int. J. Adhes Adhes, 25, 437-441 (2005). https://doi.org/10.1016/j.ijadhadh.2004.11.008
  35. D. Lu, Q. K. Tong, and C. P. Wong, "Conductivity Mechanism of Isotropic Conductive adhesives(ICA's)", IEEE Trans. Elctron. Pack, 22(3), 223-227 (1999). https://doi.org/10.1109/6104.795857
  36. D. Lu and C. P. Wong, "Effects of Shrinkage on Conductivity of Isotropic Conductive Adhesives", Int. J. Adhes Adhes, 20, 189-193 (2000). https://doi.org/10.1016/S0143-7496(99)00039-1
  37. M. Iniue and K. Suganuma, "Effects of Curing Conditions on the Electrical Properties of Isotropic Conductive Adhesives Composed of an Epoxy-based Binder", Soldering & Surface Mount Technology, 18(2), 40-45 (2006). https://doi.org/10.1108/09540910610665125
  38. M. Iniue and K. Suganuma, "The Dependance on Thermal History of the Electrical Proprties of an Epoxy-based Isotropic Conductive Adhesive", J. Electron. Mater, 36(6), 669-675 (2007). https://doi.org/10.1007/s11664-007-0125-5
  39. J. Hongjin, K. -S. Moon, Y Li, and C. P. Wong, "Ultra High Conductivity of Isotropic Conductive Adhesives, Proc. of ECTC", 485-490 (2006).
  40. C. N. He and F. Tian, "A Carbon Nanotubes-aluminium Network Structure for Fabricating Epoxy Composites", Script. Mater, 61, 285-288 (2009). https://doi.org/10.1016/j.scriptamat.2009.04.003
  41. S. Yu, M. N. Tong, and G Critchlow, "Wedge Test of Carbon-Nanotube-Reinforced Epoxy Adhesive Joints", J. Appl. Polym. Sci., 111, 2957-2962 (2009). https://doi.org/10.1002/app.29294
  42. M. Inoue, H. Muta, T Maekawa, S. Yamanaka, and K. Sug-anuma, "Thermal Conductivity of Isotropic Conductive Adhesives Composed of An Epoxy-based Binder", Proc. of HDP'06, 236-241 (2006).