정보처리학회논문지A (The KIPS Transactions:PartA)

한국정보처리학회 (Korea Information Processing Society)
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플로어플랜 기법에 따른 3차원 멀티코어 프로세서의 성능, 전력효율성, 온도 분석

Analysis of Performance, Energy-efficiency and Temperature for 3D Multi-core Processors according to Floorplan Methods

  • 최홍준 (전남대학교 전자컴퓨터공학부) ;
  • 손동오 (전남대학교 전자컴퓨터공학부) ;
  • 김종면 (울산대학교 컴퓨터정보통신공학부) ;
  • 김철홍 (전남대학교 전자컴퓨터공학부)
  • 투고 : 2010.10.06
  • 심사 : 2010.06.28
  • 발행 : 2010.12.31
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초록

공정기술 발달로 인해 칩 내부 집적도가 크게 증가하면서 내부 연결망이 멀티코어 프로세서의 성능 향상을 제약하는 주된 원인이 되고 있다. 내부 연결망에서의 지연시간으로 인한 프로세서 성능 저하 문제를 해결하기 위한 방안 중 하나로 3차원 적층 구조 설계 기법이 최신 멀티코어 프로세서를 설계하는데 있어서 큰 주목을 받고 있다. 3차원 적층 구조 멀티코어 프로세서는 코어들이 수직으로 쌓이고 각기 다른 층의 코어들은 TSV(Through-Silicon Via)를 통해 상호 연결되는 구성으로 설계된다. 2차원 구조 멀티코어 프로세서에 비해 3차원 적층 구조 멀티코어 프로세서는 내부 연결망의 길이를 감소시킴으로 인해 성능 향상과 전력소모 감소라는 장점을 가진다. 하지만, 이러한 장점에도 불구하고 3차원 적층 구조 설계 기술은 증가된 전력 밀도로 인해 발생하는 프로세서 내부 온도 상승에 대한 적절한 해결책이 마련되지 않는다면 실제로는 멀티코어 프로세서 설계에 적용되기 어렵다는 한계를 지니고 있다. 본 논문에서는 3차원 멀티코어 프로세서를 설계하는데 있어서 온도 상승 문제를 해결하기 위한 방안 중 하나인 플로어플랜 기법을 다양하게 적용해 보고, 기법 적용에 따른 프로세서의 성능, 전력효율성, 온도에 대한 상세한 분석 결과를 알아보고자 한다. 실험 결과에 따르면, 본 논문에서 제안하는 온도를 고려한 3가지 플로어플랜 기법들은 3차원 멀티코어 프로세서의 온도 상승 문제를 효과적으로 해결함과 동시에, 플로어플랜 변경으로 데이터 패스가 바뀌면서 성능이 저하될 것이라는 당초 예상과는 달리, 온도 하락으로 인해 동적 온도 제어 기법의 적용 시간이 줄어들면서 성능 또한 향상시킬 수 있음을 보여준다. 이와 함께, 온도 하락과 실행 시간 감소로 인해 시스템에서의 전력 소모 또한 줄일 수 있을 것으로 기대된다.

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.

키워드

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