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Electrodeposition of GMR Ni/Cu Multilayers in a Recirculating Electrochemical Flow Reactor

  • Rheem, Young-Woo (Department of Chemical and Environmental Engineering, University of California-Riverside)
  • Published : 2010.02.27

Abstract

The recirculating electrochemical flow reactor developed at UCLA has been employed to fabricate nanostructured GMR multilayers. For comparison, Ni/Cu multilayers have been electrodeposited from a single bath, from dual baths and from the recirculating electrochemical flow reactor. For a magnetic field of 1.5 kOe, higher GMR (Max. -5%) Ni/Cu multilayers with low electrical resistivity (< $10\;{\mu}{\Omega}{\cdot}cm$) were achieved by the electrochemical flow reactor system than by the dual bath (Max. GMR = -4.2% and < $20\;{\mu}{\Omega}{\cdot}cm$) or the single bath (Max. GMR = -2.1% and < $90\;{\mu}{\Omega}{\cdot}cm$) techniques. Higher GMR effects have been obtained by producing smoother, contiguous layers at lower current densities and by the elimination of oxide film formation by conducting deposition under an inert gas environment. Our preliminary GMR measurements of Ni/Cu multilayers from the electrochemical flow reactor obtained at low magnetic field of 0.15 T, which may approach or exceed the highest reported results (-7% GMR) at magnetic fields > 5 kOe.

Keywords

References

  1. P. M. Levy, Science, 256, 972 (1992). https://doi.org/10.1126/science.256.5059.972
  2. T. L. Hylton, K. R. Coffey, M. A. Parker and I. L.Howard, Science, 261, 1021 (1993). https://doi.org/10.1126/science.261.5124.1021
  3. J. W. Dini, Plat. & Surf. Fin., 80(1), 26 (1993).
  4. W. Schindler, Th. Koop, D. Hofmann and J. Kirscher, IEEE Trans. Magn., 34, 963 (1998). https://doi.org/10.1109/20.706327
  5. J. Yahalom and O. Zadok, U. S. Patent. 4652348 (1987).
  6. C. A. Ross, Annu. Rev. Mater. Sci., 24, 159 (1994) and references cited therein. https://doi.org/10.1146/annurev.ms.24.080194.001111
  7. N. Myung, Kevin H. Ryu, M. Schwartz and K. Nobe, in Fifth International Symposium on Magnetic Materials, Processes and Devices/ 1998, L. Romankiw, S. Krongelb and C.H Ahn, Editor, PV98-20 p. 194, The Electrochemical Society Proceedings Series, Pennington, NJ,(1998).
  8. N. V. Myung, K. H. Ryu, J. H. Kim, M. Schwartz and K. Nobe, Mater. Res. Soc. Symp. Proc. 562, (1998).
  9. D. S. Lashmore and M. P. Dariel, J. Electrochem. Soc., 135 1218 (1988). https://doi.org/10.1149/1.2095930
  10. T. Szczurek, T. Rausch, M. Schlesinger, D. D. Snyder and C. H. Olk, J. Electrochem. Soc., 145(5) 1777 (1999).
  11. D. S. Lashmore, Y. Zhang, S. Hua, M. P. Dariel, L. Swartzenruber, and L. Salamanca-Riba, in Magnetic Materials, Processes, and Devices/1994, L. T. Romankiw and D. A. Herman, Editors, PV 94-6, p.205, The ElectrochemicalSociety Proceeding Series, Pennington, NJ (1994).
  12. J. Toth, L. F. Kiss, E. Toth-Kadar, A. Dinia, V. Pierron-Bohness, I. Bakonyi, J. Magn. Magn. Mater., 199, 243(1999). https://doi.org/10.1016/S0304-8853(98)01058-0
  13. K. D. Bird and M. Schlesinger, J. Electrochem. Soc., 142,L65-66 (1995). https://doi.org/10.1149/1.2044185
  14. H. Kubota, S. Ishio and T. Miyazaki, J. Magn. Magn. Mater.,126, 462 (1993).
  15. J. Toth, L. F. Kiss, E. Toth-Kadar, A. Dinia, V. Pierron-Bohnes, I. Bakonyi, J. Magn. Magn. Mater., 199, 243 (1999). https://doi.org/10.1016/S0304-8853(98)01058-0
  16. S. Menezes and D. P. Anderson, J. Electrochem. Soc., 137, 440 (1990). https://doi.org/10.1149/1.2086459
  17. H. M Ahmad and D. Greig, J. Phys., 35, C4-223 (1974).
  18. R. M. Bozorth, 'Ferromagntism', IEEE press, p. 309 (1993).
  19. I. Bakonyi, E. Toth-Kadar, T. Becsei, J. Toth, T. Tarnoczi, A. Cziraki, I. Gerocs, G. Nabiyouni, W. Schwarzacher, J. Magn. Magn. Mater., 156, 347 (1996). https://doi.org/10.1016/0304-8853(95)00892-6
  20. A. Blondel, B. Doudin, J.-Ph. Ansermet, J. Magn. Magn.Mater., 165, 34 (1997). https://doi.org/10.1016/S0304-8853(96)00467-2

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