Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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New Mechanism for Wafer Guide to Minimize the Drop in Wafer Transfer

반송 시 웨이퍼 이탈을 최소화 하기 위한 새로운 형태의 웨이퍼 가이드 메커니즘

  • Kim, Dea-Won (School of Mechanical Engineering, Korea University of Technology and Education) ;
  • Ryu, Jee-Hwan (School of Mechanical Engineering, Korea University of Technology and Education)
  • 김대원 (한국기술교육대학교 기계정보공학부) ;
  • 유지환 (한국기술교육대학교 기계정보공학부)
  • Published : 2010.03.31
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Abstract

In this paper, wafer drop from wafer guide mechanism, which is one of the serious problems in water transfer robot, is analyzed, and new wafer guide mechanisms are proposed to minimize this drop. Three types of new wafer guide mechanisms are proposed: roller type, gear type and L-shape rocker type. We choose one of the proposed mechanism, which is roller type, and verified this mechanism through real transfer experiment. Wafer picking up test is conducted with initial aligning error for simulating the wafer drop. Number of drop is compared between conventional mechanism and proposed mechanism. As a result, we can find the proposed mechanism can reduce the number of wafer drop dramatically.

Keywords

References

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