Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Ultimate Heterogeneous Integration Technology for Super-Chip

슈퍼 칩 구현을 위한 헤테로집적화 기술

  • Received : 2010.12.01
  • Accepted : 2010.12.16
  • Published : 2010.12.30
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Abstract

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

삼차원 집적화기술의 현황과 과제 및 향후에 요구되어질 새로운 삼차원 집적화기술의 필요성에 대해 논의를 하였다. Super-chip 기술이라 불리우는 자기조직화 웨이퍼집적화 기술 및 삼차원 헤테로집적화 기술에 대해 소개를 하였다. 액체의 표면장력을 이용하여지지 기반위에 다수의 KGD를 일괄 실장하는 새로운 집적화 기술을 적용하여, KGD만으로 구성된 자기조직화 웨이퍼를 다층으로 적층함으로써 크기가 다른 칩들을 적층하는 것에 성공을 하였다. 또한 삼차원 헤테로집적화 기술을 이용하여 CMOS LSI, MEMS 센서들의 전기소자들과 PD, VC-SEL등의 광학소자 및 micro-fluidic 등의 이종소자들을 삼차원으로 집적하여 시스템화하는데 성공하였다. 이러한 기술은 향후 TSV의 실용화 및 궁극의 3-D IC인 super-chip을 구현하는데 필요한 핵심기술이다.

Keywords

References

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