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Joining and properties of electrode for CoSb3 thermoelectric materials prepared by a spark plasma sintering method

방전 플라즈마 소결법을 이용한 CoSb3계 열전재료의 전극 접합 및 특성

  • Kim, K.H. (Business Support Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Park, J.S. (Business Support Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Ahn, J.P. (Business Support Division, Korea Institute of Ceramic Engineering and Technology)
  • 김경훈 (한국세라믹기술원 기업지원본부) ;
  • 박주석 (한국세라믹기술원 기업지원본부) ;
  • 안종필 (한국세라믹기술원 기업지원본부)
  • Published : 2010.02.28

Abstract

$CoSb_3$-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of $CoSb_3$ powder and joining of $CoSb_3$ to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into $CoSb_3$ and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and $CoSb_3$ was effective to join $CoSb_3$ to Cu-Mo by forming an intermediate layer of $TiSb_2$ at the Ti-$CoSb_3$ boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/$CoSb_3$ and intermediate/intermediate layers.

중고온용 열전 소재로 우수한 특성을 나타내는 $CoSb_3$계 소재의 열전 소자 제조를 위해 방전플라즈마 소결법을 이용하여 소결 및 Cu-Mo 전극 소재와의 접합을 동시에 실시하였다. $CoSb_3$ 내부로의 Cu 확산을 방지하기 위해 Ti을 중간층으로 삽입하였으며 열팽창계수의 조절을 위해 Cu : Mo = 3 : 7 부피비 조성을 선택하였다. 삽입된 Ti과 $CoSb_3$$TiSb_2$ 이 차상을 형성하면서 접합이 진행되었지만 접합 온도 및 접합 시간의 증가에 따라 TiSb 및 TiCoSb 등의 상의 형성에 의해 접합 계면에서 균열이 발생되어 접합 특성을 악화시키는 것으로 밝혀졌다.

Keywords

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