Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Interfacial Adhesion between Screen-Printed Ag and Epoxy Resin-Coated Polyimide

에폭시수지가 도포된 폴리이미드와 스크린 프린팅 Ag 사이의 계면접착력 평가

  • Park, Sung-Cheol (School of Materials Science and Engineering, Andong National University) ;
  • Kim, Jae-Won (School of Materials Science and Engineering, Andong National University) ;
  • Kim, Ki-Hyun (Telecommunication R&D Center, Samsung Electronics) ;
  • Park, Se-Ho (Telecommunication R&D Center, Samsung Electronics) ;
  • Lee, Young-Min (Telecommunication R&D Center, Samsung Electronics) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 박성철 (안동대학교 신소재공학부 청정소재기술연구센터) ;
  • 김재원 (안동대학교 신소재공학부 청정소재기술연구센터) ;
  • 김기현 (삼성전자 통신연구소) ;
  • 박세호 (삼성전자 통신연구소) ;
  • 이영민 (삼성전자 통신연구소) ;
  • 박영배 (안동대학교 신소재공학부 청정소재기술연구센터)
  • Received : 2010.02.05
  • Accepted : 2010.03.23
  • Published : 2010.03.30
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Abstract

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

스크린 프린팅된 Ag 박막과 에폭시 수지로 코팅된 폴리이미드 사이의 계면접착력을 $180^{\circ}$ 필 테스트를 통해 정량적으로 구하였다. 스크린 프린팅된 Ag 박막과 에폭시 수지 코팅된 폴리이미드 사이 필 강도는 $164.0{\pm}24.4J/m^2$이었다. 오븐에서 $120^{\circ}C$ 조건에서 24시간 동안 열처리 한 Ag/폴리이미드의 필 강도는 $220.8{\pm}19.2J/m^2$로 증가하였고, $85^{\circ}C/85%$ 상대습도 조건에서 120시간 동안 유지한 Ag/폴리이미드의 필 강도는 $84.1{\pm}50.8J/m^2$로 감소하였다. 전계방출형 주사전자현미경과 XPS를 통해 박리된 시편 표면을 분석한 결과, 열처리 및 고온/다습조건처리 시 스크린 프린팅 Ag 박막과 에폭시 수지 코팅층 사이의 계면접착력은 에폭시 수지와 수분 사이의 가수분해 결합 반응으로 인해 계면접착력 증가 및 감소하는 경향과 밀접한 연관성이 있는 것으로 판단된다.

Keywords

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