DOI QR코드

DOI QR Code

Study on Inverse Approach to Validation of Viscoplastic Model of Sn37Pb Solder and Identification of Model Parameters

Sn37Pb 솔더의 점소성 모델 검증 및 파라메터 추정을 위한 역접근법에 관한 연구

  • Gang, Jin-Hyuk (School of Aerospace and Mechanical Engineering, Korea Aerospace Univ.) ;
  • Lee, Bong-Hee (Dept. of Engineering Mechanics, Chungbuk Nat'l Univ.) ;
  • Choi, Joo-Ho (School of Aerospace and Mechanical Engineering, Korea Aerospace Univ.) ;
  • Joo, Jin-Won (Dept. of Engineering Mechanics, Chungbuk Nat'l Univ.)
  • 강진혁 (한국항공대학교 항공우주 및 기계공학부) ;
  • 이봉희 (충북대학교 기계공학과) ;
  • 최주호 (한국항공대학교 항공우주 및 기계공학부) ;
  • 주진원 (충북대학교 기계공학과)
  • Received : 2010.04.07
  • Accepted : 2010.07.16
  • Published : 2010.10.01

Abstract

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

본 논문에서는 솔더 재료 중에서 가장 많이 사용되어 온 Sn37Pb 솔더에 대한 변형거동을 가장 정확히 나타낼 수 있는 재료 모델을 결정하기 위한 방법을 연구하였다. 이를 위해 실제 전자패키지와 유사한 변형 거동을 보이는 시편을 제작하였고 상온에서 $125^{\circ}C$ 까지의 열 사이클 하에서 모아레 간섭계를이용하여 변형을 측정하는 실험을 수행하였다. Sn37Pb 솔더에 대해 세 가지 서로 다른 구성방정식을 적용하여 시편에 대한 유한요소해석을 수행하였다. 실험 결과 나타난 시편의 굽힘 변형과 해석 결과나타난 굽힘 변형을 비교하였고, 세 가지 재료모델의 계수를 미지수로 놓고 최적설계 기법을 적용하여 유한요소 해석과 실험 결과가 최대한 일치하는 계수 값을 결정하였다. 이를 통해 Anand 에 의해 제안된 구성방정식이 솔더의 거동을 가장 잘 표현한다고 결론을 낼 수 있었다.

Keywords

References

  1. Bodner, S. R., 2002, Unified Plasticity for Engineering Applications, Kluwer Academic / Plenum Publishers, New York.
  2. Garofalo, F., 1965, Fundamentals of Creep and Creep-Rupture in Metals, The Macmillan Company, New York.
  3. Anand, L., 1985, "Constitutive Equations for Hot-Working of Metals," International Journal of Plasticity, Vol. 1, pp. 213-231. https://doi.org/10.1016/0749-6419(85)90004-X
  4. Darveaux, R., Banerji, K., Mawer, A. and Dody, G., 1995, Ball Grid Array Technology, McGraw-Hill, New York, pp. 379-442.
  5. Wiese, S., Meusel, E. and Wolter, K. J., 2003, "Microstructural Dependence of Constitutive Properties of Eutectic SnAg and SnAgCu Solders," Proceedings of 53th Electronic Components and Technology Conference, pp. 197-206.
  6. Feustel, F., Wiese, S. and Meusel, E., 2000, "Time-Dependent Material Modeling for Finite Element Analyses of Flip Chips," Proceedings of 50th Electronic Components and Technology Conference, pp. 1548-1553.
  7. Darveaux, R., 1997, "Solder Joint Fatigue Life Model," Proceedings of 1997 TMS Annual Meeting, pp. 213-218.
  8. Wang, G. Z., Cheng, Z. N., Becker, K. and Wilde, J., 2001, "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys," Journal of Electronic Packaging, Vol. 123, No. 3, pp. 247-253. https://doi.org/10.1115/1.1371781
  9. Ye, H., Lin, M. and Basaran, C., 2002, "Failure Modes and FEM analysis of power electronic packaging," Finite Elements in Analysis and Design, Vol, 38, Issue 7, pp. 601-612. https://doi.org/10.1016/S0168-874X(01)00094-4
  10. Yeo, A., Lee, C. and Pang, H. L., 2006, "Flip Chip Solder Reliability Analysis Using Viscoplastic and Elastic-Plastic-Creep Constitutive Models," IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 355-363. https://doi.org/10.1109/TCAPT.2006.875893
  11. Kim, J. Y., Choi, J. H. and Joo, J. W., 2008, "A study on robust optimization of layered plates bonding process based on inverse analysis," Journal of Materials Processing Technology, Vol. 201, Issues 1-3, pp. 261-266. https://doi.org/10.1016/j.jmatprotec.2007.11.223
  12. Joo, J. W., Kim, H. J., Lee, W. H., Kim, J. Y. and Choi, J. H., 2007, "Material Parameters Identification of Adhesive in Layered Plates Using Moire Interferometry and Optimization Technique," Trans. of the KSME (A), Vol. 31, No. 11, pp. 1100-1107. https://doi.org/10.3795/KSME-A.2007.31.11.1100
  13. Post, D., Han, B. and Ifju, P., 1997, High Sensitivity Moire: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York.
  14. Oh, K. H. and Joo, J. W., 2004, "Submicro-displacement Measuring System with Moire Interferometer and Application to the Thermal Deformation of PBGA Package," Trans. of the KSME (A), Vol. 28, No. 11, pp. 1646-1655. https://doi.org/10.3795/KSME-A.2004.28.11.1646
  15. Hall, P. M., 1984, "Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-7, No. 4, pp. 314-327.
  16. Frear, D., Grivas, D. and Morris, J. W., 1988, "A Microstructural Study of the Thermal Fatigue Failures of 60Sn-40Pb Solder Joints," Journal of Electronics Materials, Vol. 17, No. 2, pp. 171-180. https://doi.org/10.1007/BF02652148
  17. Pao, Y. -H., Badgley, S., Jih, E., Govila, R. and Browning, J., 1993, "Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints," Journal of Electronic Packaging, Vol. 115, Issue 2, pp. 147-152. https://doi.org/10.1115/1.2909310
  18. Pollack, D., 2003, "Validity of constitutive properties of ANAND model as applied to thermomechanical deformation analysis of eutectic solder, " Master of Science Thesis, University of Maryland.
  19. Dowling, N. E., 2007, Mechanical Behavior of Materials, Pearson Education International, New Jersey, pp. 772-848.
  20. Dieter, G. E., 1988, Mechanical Metallurgy, McGraw-Hill, London.
  21. Shi, X. Q., Zhou, W., Pang, H. L. J. and Wang, Z. P., 1999, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy," Journal of Electronics Packaging, Vol. 121, pp. 179-185 https://doi.org/10.1115/1.2792681
  22. Lau, J. H., 1994, Handbook of Fine Pitch Surface Mount Technology, Wiley, New York.
  23. Qin, F., An, T. and Chen, N., 2010, "Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders," Journal of Applied Mechanics, Vol. 77, Issue 1.
  24. Manko, H. H., 2001, Solders and Soldering, McGraw-Hill, New York.