The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
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Analysis of LED Package Properties by PCB Material and Via-hole Construction

PCB 재질 및 Via hole 구성에 따른 LED 패키지의 특성 분석

  • 이세일 (원광대학교 공대 정보통신과) ;
  • 양종경 (원광대학교 공대 정보통신과) ;
  • 김성현 (원광대학교 공대 정보통신과) ;
  • 이승민 (금호전기(주) 기술원 연구1팀) ;
  • 박대희 (원광대학교 전기전자 및 정보공학부)
  • Received : 2010.08.06
  • Accepted : 2010.09.29
  • Published : 2010.11.01
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Abstract

In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

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References

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