설비공학논문집 (Korean Journal of Air-Conditioning and Refrigeration Engineering)

  • 제22권9호
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  • Pages.614-619
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  • 2010
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  • 1229-6422(pISSN)
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  • 2465-7611(eISSN)
대한설비공학회 (The Society of Air-Conditioning and Refrigerating Engineers of Korea)
권호 표지

소형의 평판형 냉각장치 개발

Development of Small Flat Plate Type Cooling Device

  • 문석환 (한국전자통신연구원 융합부품소재연구부문) ;
  • 황건 (한국전자통신연구원 융합부품소재연구부문) ;
  • 강승열 (한국전자통신연구원 융합부품소재연구부문) ;
  • 조경익 (한국전자통신연구원 융합부품소재연구부문)
  • Moon, Seok-Hwan (Convergence and Components and Materials Research Lab., Electronics and Telecommunications Research Institute) ;
  • Hwang, Gunn (Convergence and Components and Materials Research Lab., Electronics and Telecommunications Research Institute) ;
  • Kang, Seung-Youl (Convergence and Components and Materials Research Lab., Electronics and Telecommunications Research Institute) ;
  • Cho, Kyoung-Ik (Convergence and Components and Materials Research Lab., Electronics and Telecommunications Research Institute)
  • 투고 : 2009.10.20
  • 발행 : 2010.09.10
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초록

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.

키워드

참고문헌

  1. Moon, S. H. et al., 2008, Development of Flat Plate Type Small Cooling Device, 2008 Proc. of SAREK Winter Conf., pp. 170-174.
  2. Moon, S. H. et al., 2000, A Study on Cooling Characteristics of Miniature Heat Pipes with Woven-Wired Wick, Korean J. of Air-Conditioning and Refrigeration Engineering, Vol. 12, No. 4, pp. 227-234.
  3. Kirshberg, J. et al., 2000, Cooling Effect of a MEMS Based Micro Capillary Pumped Loop for Chip-Level Temperature Control, ASME 2000, MEMS, Vol. 2, pp. 143-150.
  4. Hoelke, A. et al., 1999, Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe, ASME 1999, Vol. 3, pp. 53-60.
  5. Meyer, L., 2003, A Silicon-Carbide Micro-Capillary Pumped Loop for Cooling High Power Devices, 19th IEEE Semi-Therm Symp., pp. 364-368.
  6. Suh, J. S. et al., 2001, Friction in Micro-Channel Flows of a Liquid and Vapor in Trapezoidal and Sinusoidal Grooves, Int. J. of Heat and Mass Transfer, Vol. 44, pp. 3103-3109. https://doi.org/10.1016/S0017-9310(00)00331-8
  7. Khrustalev, D., et al., 1994, Heat Transfer During Evaporation and Condensation on Capillary- Grooved Structures of Heat Pipe, Proc. ASME Winter Annual Meeting, Chicago, HTDVol. 287, pp. 47-59.