Journal of the Korea Institute of Information and Communication Engineering (한국정보통신학회논문지)

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
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Analysis of Optical Process Depending On Texturing Process of Si Wafer

실리콘 웨이퍼의 표면조직화에 따른 광학적 특성분석

  • Received : 2011.06.18
  • Accepted : 2011.07.08
  • Published : 2011.11.30
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Abstract

To obtain the effect of texturing process in Solar cells, the Si-wafers were textured by using the IPA+DI water mixed etching solution with KOH alkaline. All samples were analyzed by the scanning electron microscopy for the surface images, and it was researched the correlation between the efficiency of optical properties and the effect of texturing. From the results of the surface images obtained by SEM, mc-Si wafer shows a isotropic surface but sc-Si wafers displays the unisotropic surface. The reflectance was improved at the sc-Si wafer textured uniformly, and the reflectance of over etched-samples increased.

태양전지를 제작하는데 실리콘기판 표면에서의 광 흡수를 증가시키기 위한 표면조직화를 위해서 염기 용액을 이용한 습식방법을 이용하여 샘플을 제작하였다. 이렇게 준비된 염기성 에칭용액을 이용한 실리콘 웨이퍼의 표면 상태를 관찰하여 광학적 특성과의 연관성을 조사하였다. 표면조직화가 표면 전체적으로 고르게 이루어진 샘플에서 반사도가 낮았으며, 광학적 특성이 좋게 나타났다. 에칭이 과도하게 일어난 샘플에서는 오히려 반사도가 증가하여 광학적 특성이 떨어지는 것을 확인 하였다.

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References

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