Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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Plan Study of Improvement on Thermal Flow at Computer Main Frame

컴퓨터 본체 구조의 열유동에 관한 개선 방안 검토

  • 조재웅 (공주대학교 기계자동차공학부) ;
  • 한문식 (계명대학교 기계자동차공학과)
  • Received : 2010.10.11
  • Accepted : 2011.01.03
  • Published : 2011.02.28
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Abstract

This study is to analyze the internal flow at the inside of computer case which is commonly used. The inner configuration are modelled and simulation analysis is done by ANSYS-CFX. Dead volume is happened according to the positioning of VGA and HDD. The advanced model is suggested by removing this volume and making the smooth cooling flow. This model is formed with the constraint conditions same as the existing model. As compared with the existing model, flow configuration is different and the average temperature becomes lower through flow analysis about the advanced model.

Keywords

References

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