Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of Glass Additions on the Adhesion and Electrical Conductivity of Photoimageable Silver Paste

  • Lee, Eun-Heay (Korea Institute of Ceramic Engineering & Technology) ;
  • Heo, Yu-Jin (Korea Institute of Ceramic Engineering & Technology) ;
  • Kim, Hyo-Tae (Korea Institute of Ceramic Engineering & Technology) ;
  • Kim, Jong-Hee (Korea Institute of Ceramic Engineering & Technology)
  • Received : 2011.10.18
  • Accepted : 2011.12.27
  • Published : 2011.12.30
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Abstract

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

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References

  1. R. Tummala, "SOP: Microelectronic Systems Packaging Technology for the 21st Century", Advancing Microelectronics, May/June, 31 (1999).
  2. J. Muller, R. Perrone, K. -H. Drue, R. Stephan, J. Trabert, M. Hein, D. Schwanke, J. Pohlner, G. Reppe, R. Kulke, P. Uhlig, A. F. Jacob, T. Baras and A. Moke, "Comparison of High Resolution Patterning Technologies for LTCC Microwave Circuits", Proc. IMAPS/Acers.3rd CICMT, Denver, 99, International Microelectronics and Packaging Society (2007).
  3. M. Skurski, M. Smith, R. Draudt, D. Amey, S. Horowitz and M. Champ, "Photoimageable Silver Cofirable Conductor Compatible with 951 Green Tape", Int. J. Microcircuits and Electronic Packaging, 21(4), 355 (1998).
  4. T. Masaki, A. Yoshimura, K. Iwanaga and G. Tanaka, "Pho-tosensitive Conductive Paste", Proc. IEMT/IMC Symposium, Tokyo, 356, IEEE CPMT (1997).
  5. Erick Kim, Y. S. Lee, S. D. Park and J. C. Park, "A Study on the Development of Mllimeter-wave Band Pass Filter using the Photoimageable Thick Film Technology", Proc. J. Microelectron. Packag. Soc., (Fall Meeting), Suwon, 87, IMAPS-Korea (2002).
  6. S. D. Park, Y. S. Lee, H. M. Cho, W. S. Lee and J. C. Park, "Formation of Fine Line and Series Gap Resonator using the Photoimageable Thick Film Technology", J. Microelectron. Packag. Soc., 8(3), 69 (2001).
  7. T. Tick, J. Jantti, M. Henry, C. Free and H. Jantunen, "LTCC Integrated Air-filled Waveguides for G-band Applications", Microwave and Optical Technology Letters, 51(1), 176 (2009). https://doi.org/10.1002/mop.23965
  8. H. Yang, L. -T. A. Cheng, T. R. Suess and C. L. Weng, "Coprocessable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices", US Patent, US 2009/0284122 A1, Nov. 19 (2009).
  9. I. Wyzkiewicz, N. Gorniak, M. Jakubowska, Z. Brzozka and A. Dybko, "Hybrid Microstructures for Capillary Electrophoresis with Micro-channel in Photosensitive Layer", Proc. SPIE, San Jose, 6937, The International Society for Optical Engineering (2007).
  10. G. G. Umarji, S. A. Ketkar, G. J. Phatak, T. Seth, U. P. Mulik and D. P. Amalnerkar, "Photoimageable Silver Paste for High Density Interconnection Technology", Mater. Lett., 59, 503 (2005). https://doi.org/10.1016/j.matlet.2004.10.034
  11. S. A. Ketkar, G. G. Umarji, G. J. Phatak, J. D. Ambekar, I. C. Rao, U. P. Mulik and D.P. Amalnerkar, "Lead-free Photoimageable Silver Conductor Formulation for High Density Electronic Packaging", Mat. Sci. Eng. B, 132, 215 (2006). https://doi.org/10.1016/j.mseb.2006.02.027
  12. S. D. Park, M. J. Lee, N. K. Kang, J. C. Park, J. K. Lim and D. K. Kim, "Fabrication of Photoimageable Silver Paste for Low-temperature Cofiring Using Acrylic Binder Polymers and Photosensitive Materials", Macromol. Res., 12(4), 391 (2004). https://doi.org/10.1007/BF03218417
  13. H. T. Kim, J. W. Lim, D. Y. Jung, C. S. Park, J. H. Nam, D. H. Yeo, H. S. Shin, T. Masaki and J. H. Kim, "Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology", Proc. IMAPS/Acers 3rd CICMT, Denver, 23, IMAPS (2007).
  14. M. E. Twentyman., "High Temperature Metallizing", J. Mater. Sci., 10, 765 (1975). https://doi.org/10.1007/BF01163071
  15. Y. S. Chung and H. G. Kim, "Effect of Oxide Glass on the Sintering Behavior and Electrical Properties in Ag Thick Films", IEEE Trans. Compo. Hybrids Manuf. Technol., 11(2), 195 (1988). https://doi.org/10.1109/33.2987