DOI QR코드

DOI QR Code

Thermodynamic Prediction of SiC Deposition in C3H8-SiCl4-H2 System

C3H8-SiCl4-H2 시스템에서의 탄화 실리콘 증착에 대한 열역학적인 해석

  • Kim, Jun-Woo (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology) ;
  • Jeong, Seong-Min (Business Support Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyung-Tae (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Kyung-Ja (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology) ;
  • Lee, Jong-Heun (Department of Material Science and Engineering, Korea University) ;
  • Choi, Kyoon (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology)
  • 김준우 (한국세라믹기술원 이천분원) ;
  • 정성민 (한국세라믹기술원 기업지원본부) ;
  • 김형태 (한국세라믹기술원 이천분원) ;
  • 김경자 (한국세라믹기술원 이천분원) ;
  • 이종흔 (고려대학교 재료공학과) ;
  • 최균 (한국세라믹기술원 이천분원)
  • Received : 2011.03.28
  • Accepted : 2011.04.26
  • Published : 2011.05.31

Abstract

In order to deposit a homogeneous and uniform ${\beta}$-SiC films by chemical vapor deposition, we demonstrated the phase stability of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure, temperature and gas composition as variables. The ${\beta}$-SiC predominant region over other solid phases like carbon and silicon was changed gradually and consistently with temperature and pressure. Practically these maps provide necessary conditions for homogeneous ${\beta}$-SiC deposition of single phase. With the thermodynamic analyses, the CVD apparatus for uniform coating was modeled and simulated with computational fluid dynamics to obtain temperature and flow distribution in the CVD chamber. It gave an inspiration for the uniform temperature distribution and low local flow velocity over the deposition chamber. These calculation and model simulation could provide milestones for improving the thickness uniformity and phase homogeneity.

Keywords

References

  1. K.-S. Cho, S.-H. Yoon, H. Chung, S.-H. Chae, K.-Y. Lim, Y.-W. Kim, and S.-H. Park, “SiC Materials Techniques for Semiconductor Production Line,” Ceramist, 10 [6] 33-48 (2007).
  2. Y. Yan and Z. Weigang, “Kinetic and Microstructure of SiC Deposited from $SiCl_4-CH_4-H_2$,” Chin. J. Chem. Eng., 17 [3] 419-26 (2009). https://doi.org/10.1016/S1004-9541(08)60226-8
  3. R. Wang and R. Ma, “Kinetics of Halide Chemical Vapor Deposition of Silicon Carbide Film,” J. Crystal Growth, 308 [1] 189-197 (2007). https://doi.org/10.1016/j.jcrysgro.2007.07.038
  4. G. Chichignoud, M. Ucar-Morais, M. Pons, and E. Blanquet, “Chlorinated Silicon Carbide CVD Revisited for Polycrystalline Bulk Growth,” Surf. Coat. Tech., 201 [22-3] 8888-92 (2007).
  5. H. Habuka, M. Watanabe, M. Nishida, and T. Sekiguchi, “Polycrystalline Silicon Carbide Film Deposition using Monomethylsilane and Hydrogen Chloride Gases,” Surf. Coat. Tech., 201 [22-3] 8961-65 (2007). https://doi.org/10.1016/j.surfcoat.2007.04.023
  6. J. Nishio, M. Hasegawa, K. Kojima, T. Ohno, Y. Ishida, T. Takahashi, T. Suzuki, T. Tanaka, and K. Arai, “Uniformity of 4H-SiC Epitaxial Layers Grown on 3-in Diameter Substrates,” J. Crystal Growth, 258 [1-2] 113-22 (2003). https://doi.org/10.1016/S0022-0248(03)01498-2
  7. J. Lu, Z. Zhang, and Q. Chen, “Numerical Simulation of the Flow Field and Concentration Distribution in the Bulk Growth of Silicon Carbide Crystals,” J. Crystal Growth, 292 [2] 519-22 (2006). https://doi.org/10.1016/j.jcrysgro.2006.04.067