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Development of Knowledge Sharing Platform for Digitization of Surface Mount Technology

생산기반기술 디지털화를 위한 지식공유형 플랫폼 개발: 전자패키지 표면실장기술을 중심으로

  • Received : 2011.02.25
  • Accepted : 2011.03.11
  • Published : 2011.03.31

Abstract

In this paper, we introduce knowledge sharing platform for production technology. Surface mount technology (SMT) is one of the important production technologies to fabricate electronic devices. The production technology of the SMT, however, has been propagated from an experienced worker to an inexperienced worker in a manufacturing field. The objective of the knowledge sharing platform is to convert the production experiences like a solder printing knowhow into quantitative values, to construct the database of the process technologies, and to share the technologies systematically via web portal service. In addition, the knowledge sharing platform contains the total production process of mobile products, the information of experts and facilities, and recent R&D output. In this manner, the knowledge sharing platform for production technology could strengthen the technological competitiveness of small and medium manufacturing companies in Korea.

Keywords

References

  1. M. H. Jeong, J. M. Kim, S. H. Yoo, C. W. Lee and Y. B. Park, "Effect of PCB surface finishs on intermetallic compound growth kinetics of Sn-3.0Ag-0.5Cu solder bump", J. Micro-electron. Packag. Soc., 17(1), 81 (2010).
  2. Korea Industrial Technology Foundation, "Industrial Technology Roadmap in 2006", Korea Industrial Technology Foundation, (2007).
  3. P. Drucker, "The Future That Has Already Happened", The Futurist, 32(8), 16 (1998).
  4. S. B Modi and V. A Mabert, "Supplier Management: Improving Supplier Performance Through Knowledge Management", J. Operations Management, 25, 682 (2007). https://doi.org/10.1016/j.jom.2006.04.007
  5. IDEA Consult, "Evaluation of the European Technology Plat-forms(ETPs)", IDEA Consult, Final report, Aug, (2008).
  6. K. Mori, "Digital Manufacturing Research", J. Precis. Eng. Manuf., 26(3), 23 (2005).
  7. W. S. Seo, B. W. Min, J. H. Kim, N. K. Lee and J. B. Kim, "An Analysis of Screen Printing using Solder Paste", J. Microelectron. Packag. Soc., 17(1), 47 (2010).
  8. S. C. Park, J. W. Kim, K. Kim, S. Park, Y. Lee and Y. B. Park, "Interfacial Adhesion between Screen-Printed Ag and EpoxyResin-Coated Polyimide", J. Microelectron. Packag. Soc., 17(1), 41 (2010).