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Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive

에폭시 접착제의 경화거동 및 접합강도에 미치는 경화촉매제의 영향

  • Kim, Min-Su (Advanced Welding & Joining Technology Center/Micro-Joining Center, KITECH) ;
  • Kim, Hae-Yeon (Advanced Welding & Joining Technology Center/Micro-Joining Center, KITECH) ;
  • Yoo, Se-Hoon (Advanced Welding & Joining Technology Center/Micro-Joining Center, KITECH) ;
  • Kim, Jong-Hoon (Advanced Welding & Joining Technology Center/Micro-Joining Center, KITECH) ;
  • Kim, Jun-Ki (Advanced Welding & Joining Technology Center/Micro-Joining Center, KITECH)
  • 김민수 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김해연 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 유세훈 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김종훈 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김준기 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터)
  • Received : 2011.04.01
  • Accepted : 2011.08.18
  • Published : 2011.08.31

Abstract

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

Keywords

References

  1. L. Tong, G. P. Steven : Analysis and design of structural bonded joint, Kluwer Academic Publishers, 1999, 2
  2. F. L. Barcia, B. G. Soares, E. Sampaio : Adhesive properties of epoxy resin modified by endfunctionalized liquid polybutadiene, J. App. Polym. Sci., 93-5 (2004), 2370-2378 https://doi.org/10.1002/app.20739
  3. S. Yu, M. N. Tong, G. Critchlow : Use of carbon nanotubes reinforced epoxy as adhesives to join aluminum plates, Mater. Des., 31-S1 (2010), S126-S129 https://doi.org/10.1016/j.matdes.2009.11.045
  4. K. H. Lee : Recent technology for improvement of fuel economy in automotive gasoline engines, J. Kor. Soc. Auto. Eng., 17-1 (1995), 44-53 (in Korean)
  5. K. Shibata : Future vehicles and materials technologies, Automotive Engineering - lightweight, functional, and novel materials(eds. B. Cantor, P. Grant, C. Johnstion), CRC Press, 2008, 3-17
  6. M. Goede, M. Stehlin, K. Rafflenbeul, G. Kopp, E. Beeh : Super light car - lightweight construction thanks to a multi-material design and function integration, Eur. Transp. Res. Rev., 1-1 (2009), 5-10 https://doi.org/10.1007/s12544-008-0001-2
  7. T. K. Han, K. Y. Lee, J. S. Kim : Recent developments and weldability of advanced high strength steels for automotive applications, Journal of KWJS, 27-2 (2009), 131-136 (in Korean) https://doi.org/10.5781/KWJS.2009.27.2.013
  8. T. A. Barnes, I. R. Pashby : Joining techniques for aluminium spaceframes used in automobiles part II - adhesive bonding and mechanical fasteners, J. Mater. Process. Technol., 99-1-3 (2000), 72-79 https://doi.org/10.1016/S0924-0136(99)00361-1
  9. D. Y. Choi, Y. G. Kim : Trend of joining technology for automotive sheet steels, Journal of KWJS, 27-3 (2009), 125-130 (in Korean)
  10. E. M. Petrie : Epoxy adhesive formulations, McGraw-Hill, 2006, 18-24, 106-107
  11. S. G. Prolongo, G. del Rosario, A. Urena : Comparative study on the adhesive properties of different epoxy resin, Int. J. Adhes. Adhes., 26-3 (2006), 125-132 https://doi.org/10.1016/j.ijadhadh.2005.02.004
  12. T. Guthner, B. Hammer : Curing of epoxy resins with dicyandiamide and urones, J. App. Polym. Sci., 50-8 (1993), 1453-1459 https://doi.org/10.1002/app.1993.070500817
  13. Y. R. Ham, S. H. Kim, Y. H. Shin, D. H. Lee, M. H. Yang, J. H. Min, J. S. Shin : A comparison of some imidazoles in the curing of epoxy resin, J. Ind. Eng. Chem., 16-4 (2010), 556-559 https://doi.org/10.1016/j.jiec.2010.03.022
  14. T. Hatakeyama, Z. Liu : Handbook of thermal analysis, John Wiley & Sons, 1998, 53-54
  15. D. W. Seo, J. K. Lim : Tensile, bending and shear strength distributions of adhesive-bonded butt joint specimens, Compos. Sci. Technol., 65-9 (2005), 1421-1427 https://doi.org/10.1016/j.compscitech.2004.12.013
  16. R. D. Adams, J. Comyn, W. C. Wake : Structural adhesive joints in engineering 2nd edition, Chapman & Hall, 1997, 17-20
  17. L. F. M. da Silva, R. J. C. Carbas, G. W. Critchlow, M. A. V. Figueiredo, K. Brown : Effect of material, geometry, surface treatment and environment on the shear strength of single lap joints, Int. J. Adhes. Adhes., 29-6 (2009), 621-632 https://doi.org/10.1016/j.ijadhadh.2009.02.012

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