Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지
DOI QR코드

DOI QR Code

Observation of Thermal Conductivity of Pressureless Sintered AlN Ceramics under Control of Y2O3 Content and Sintering Condition

Y2O3 함량과 소결조건에 따른 상압소결 AlN 세라믹스의 열전도도 고찰

  • Received : 2011.08.10
  • Accepted : 2011.08.19
  • Published : 2011.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

Aluminum nitride (AlN) has excellent thermal conductivity, whereas it has some disadvantage such as low sinterability. In this study, the effects of sintering additive content and sintering condition on thermal conductivity of pressureless sintered AlN ceramics were examined on the variables of 1~3 wt% sintering additive ($Y_2O_3$) content at $1900^{\circ}C$ in $N_2$ atmosphere with holding time of 2~10 h. All AlN specimens showed higher thermal conductivity as the $Y_2O_3$ content and holding time increase. The formation of secondary phases (yttrium aluminates) by reaction of $Y_2O_3$ and $Al_2O_3$ from AlN surface promoted the thermal conductivity of AlN specimens, because the secondary phases could reduce the oxygen contents in AlN lattice. Also, thermal conductivity was increased by long sintering time because of the uniform distribution and the elimination of the secondary phases at the grain boundary by the evaporation effect during long holding time. A carbothermal reduction reaction was also affected on the thermal conductivity. The thermal conductivity of AlN specimens sintered at $1900^{\circ}C$ for 10 h showed 130~200W/mK according to the content of sintering additive.

Keywords

References

  1. G. A. Slack, "Nonmetallic Crystals with High Thermal Conductivity." J. Phys. Chem. Solids," 34 321-35 (1973). https://doi.org/10.1016/0022-3697(73)90092-9
  2. L. M. Sheppard, "Aluminum Nitride : a Versatile but Challenging Material," Am. Ceram. Soc. Bull., 69 1801-12 (1990).
  3. Y. Baik and R. A. Drew, "Aluminum Nitride : Processing and Applications," Key Eng. Mater., 122-124 553-60 (1996). https://doi.org/10.4028/www.scientific.net/KEM.122-124.553
  4. J. H. Chae, J. S. Park, J. P. Ahn, and K. H. Kim, "Microstructure and Thermal Conductivity of AlN Ceramics with $Y_2O_3$ Fabricated by Pressureless Sintering," J. Kor. Crystal Growth and Crystal Tech., 19 33-8 (2009).
  5. K. Komeya, H. Hiroshi, and A. Tsuge, "Effect of Various Additives on Sintering of Aluminum Nitride," J. Ceram. Soc. Japan, 89 330-6 (1981). https://doi.org/10.2109/jcersj1950.89.1030_330
  6. M. Kasori and F. Ueno, "Thermal Conductivity Improvement of YAG Added AlN Ceramics in Grain Boundary Elimination Process," J. Euro. Ceram. Soc., 15 435-43(1995). https://doi.org/10.1016/0955-2219(95)91432-N
  7. K. Watari, K. Ishizaki, and T. Fujikawa, "Thermal Conductivity Mechanism of Aluminum Nitride," J. Mater. Sci., 27 2627-30 (1992). https://doi.org/10.1007/BF00540680
  8. K. Komeya, H. Inoue, and A. Tsuge, "Effect of Various Additives on Sintering of Aluminum Nitride," J. Jpn. Ceram. Soc, 108 S93-S100 (2000). https://doi.org/10.2109/jcersj.108.1262_S93
  9. K. Komeya, H. Inoue, and A. Tsuge, "Role of $Y_2O_3$ and $SiO_2$ Additions in Sintering of AlN," J. Am. Ceram. Soc., 57 411 (1974). https://doi.org/10.1111/j.1151-2916.1974.tb11428.x
  10. A. V. Vickar, T. B. Jackson, and R. A. Cutler, "Thermdoynamic and Kinetic Effects of Oxygen Removal on the Thermal Conductivity of Aluminum Nitride," J. Am. Ceram. Soc., 72 2031-42 (1989). https://doi.org/10.1111/j.1151-2916.1989.tb06027.x
  11. T. B. Jackson, A. V. Virkar, K. L. More, R. B. Dinwideie, and R. A. Culter, "High Thermal Conductivity of Aluminum Nitride Ceramics : the Effect of Thermodynamic, Kinetic and Microstructural Factors," J. Am. Ceram. Soc., 80 1421-35 (1997).
  12. G. Pezzotti, A. Nakahira, and M. Tahjika, "Effect of Extended Annealing Cycles on the Thermal Conductivity of $AlN/Y_2O_3$ Ceramics," J. Euro. Ceram. Soc., 20 1319-25 (2000). https://doi.org/10.1016/S0955-2219(99)00286-1
  13. S. Mitra, G. Dutta, and I. Dutta, "Effect of Heat Treatment on the Microstructure and Properties of Dense AlN Sintered with $Y_2O_3$ Additions," J. Am. Ceram. Soc., 78 2335-44 (1995). https://doi.org/10.1111/j.1151-2916.1995.tb08666.x
  14. K. Watari and H. Nankato, "Microstructure and Thermal Conductivity Mechanism of High-Thermal-Conductivity AlN Ceramics," J. Jpn. Ceram. Soc., 39 678-83 (2004).
  15. K. Watrari, M. Kawamoto, and K. Ishizaki, "Sintering Chemical Reactions to Increase Thermal Conductivity of Aluminum Nitride," J. Mater. Sci., 26 4727-32 (1991). https://doi.org/10.1007/BF00612411
  16. T. Nakamatsu, F. Pomar, and K. Ishizaki, "The Effect of Carbon Coating of AlN Powder on Sintering Behavior and Thermal Conductivity," J. Mater. Sci., 34 1553-56 (1999). https://doi.org/10.1023/A:1004568314326
  17. S. M. Lee and D. G. Kim, "Development of AlN Ceramics for Semiconductor Industry," Ceramist, 12 [1] 18-25 (2009).
  18. S. G. Ko, "Property and Application of AlN Ceramic," Ceramist, 14 [1] 29-34 (2011).

Cited by

  1. Effect of Interface on Thermal Conductivity of Clad Metal through Thickness Direction for Heat Sink vol.22, pp.3, 2015, https://doi.org/10.6117/kmeps.2015.22.3.067
  2. Evaluation of Thermal Conductivity for Screen-Printed AlN Layer on Al Substrate in Thickness Direction vol.22, pp.4, 2015, https://doi.org/10.6117/kmeps.2015.22.4.065
  3. Thermal Properties of Two-Layered Materials Composed of Dielectric Layer on Metallic Substrate along the Thickness Direction vol.23, pp.4, 2016, https://doi.org/10.6117/kmeps.2016.23.4.087