Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Interfacial Microstructures between Ag Wiring Layers and Various Substrates

Ag 인쇄배선과 이종재료기판과의 접합계면

  • Received : 2011.10.06
  • Accepted : 2011.10.19
  • Published : 2011.09.30
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Abstract

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

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References

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