DOI QR코드

DOI QR Code

TiO2/Si3N4/Ag/Si3N4/TiO2 다층구조에서 Si3N4 버퍼층이 투과율에 미치는 영향

Effect of Si3N4 Buffer Layer on Transmittance of TiO2/Si3N4/Ag/Si3N4/TiO2 Multi Layered Structure

  • 이서희 (충북대학교 신소재공학과) ;
  • 장건익 (충북대학교 신소재공학과)
  • Lee, Seo-Hee (Department of Materials Engineering, Chungbuk National University) ;
  • Jang, Gun-Eik (Department of Materials Engineering, Chungbuk National University)
  • 투고 : 2011.10.28
  • 심사 : 2011.12.02
  • 발행 : 2012.01.01

초록

The $TiO_2/Si_3N_4/Ag/Si_3N_4/TiO_2$ multi layered structure was designed for the possible application of transparent electrodes in PDP (Plasma Display Panel). Multi layered film was deposited on a glass substrate at room temperature by DC/RF magnetron sputtering system and EMP (Essential Macleod Program) was adopted to optimize the optical characteristics of film. During the deposition process, the Ag layer in $TiO_2/Ag/TiO_2$ became heavily oxidized and the filter characteristic was degraded easily. In thus study, Si3N4 layer was used as a diffusion buffer layer between $TiO_2$ and Ag. in order to prevent the oxidation of Ag layer in $TiO_2/Si_3N_4/Ag/Si_3N_4/TiO_2$ structure. It was confirmed that $Si_3N_4$ layer is one of candidate materials acting as diffusin barrier between $TiO_2/Ag/TiO_2$.

키워드

참고문헌

  1. H. Ohsaki and Y. Kokubu, Thin Solid Films, 351, 1 (1999). https://doi.org/10.1016/S0040-6090(99)00147-9
  2. M. Fhaland, P. Karlsson, and C. Charton, Thin Solid Films, 392, 334 (2001). https://doi.org/10.1016/S0040-6090(01)01053-7
  3. M. Bender, W. Seeling, C. Daube, H. Frankenberger, B. Ocker, and J. Stollenwerk, Thin Solid Films, 326, 67(1998). https://doi.org/10.1016/S0040-6090(98)00520-3
  4. D. Kim, Trans. Electr. Electron. Mater., 10, 165 (2009). https://doi.org/10.4313/TEEM.2009.10.5.165
  5. J. H. Lee, S. H. Lee, and C. K. Hwangbo, J. Korean Phys. Soc., 44, 750 (2004). https://doi.org/10.3938/jkps.44.750
  6. W. S. Oh, S. H. Lee, G. E. Jang, and S. W. Park, J. KIEEME, 23, 681 (2010). https://doi.org/10.4313/JKEM.2010.23.9.681