Journal of the Korean Society of Safety (한국안전학회지)

The Korean Society of Safety (한국안전학회)
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Analysis of the Junction Temperature in the LED Chips using the Finite Element Method

유한요소법을 이용한 LED 칩의 접합부 온도 해석

  • Received : 2012.09.17
  • Accepted : 2012.12.05
  • Published : 2012.12.31
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Abstract

It is difficult to determine the junction temperature because LED lightings are manufactured using several chips with low power. This paper reports on the finite element method of the determination of junction temperature in the GaN-based LEDs. The calculated junction temperature of the LED chip using FEM was compared with the experimentally measured data. As the results of this study, the junction temperature of LED chips with via holes is lower than that of LED chips without via hole. Therefore, the research of via hole is necessary to decrease junction temperature of LED chips.

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Acknowledgement

Supported by : 호서대학교

References

  1. Rovert. V. steele, "Proceeding of SPIE" High-brightness LED matket overview, Vol. 4445, p. 1, 2001.
  2. Jianzheng Hu, Liangiao Yang and Moo Whan Shin, "Electrical, Optical and Thermal Degradation of High Power GaN/In Gan Light-emitting Diodes" J. phys. D : Appl. phys, p.41, 2008.
  3. Jeong Park, Moo Whan Shin, and Chin C. Lee, "Optics letters" Vol. 29, No. 22, p. 2656, 2004. https://doi.org/10.1364/OL.29.002656
  4. Lugiao Yin, Liagiao Yang, and Weigiao Yang, "Thermal Design and Analysis of Multi-chip LED Module with Ceramic Substrate" Solid-state electrnics, Vol. 54, pp.1520-1524, 2010.
  5. Dong Kwon Kim, Jae hoon Jung, and Sung Jim Kim, "Thermal Optimization of Plate-fim Heatsinks with Variable Fin Thickness" Int. J. of heat and mass transfer, Vol. 53, pp. 5988-5995, 2010. https://doi.org/10.1016/j.ijheatmasstransfer.2010.07.052
  6. Wen Chin Chen, Tung Tson Lai, Min Wen Wang, and Hsian-Wen Hung, "An Opimization System for LED Lens Design" Expert systems with opplication, Vol. 38, No. 9, pp.11978-11983, 2011.
  7. Seung Min Lee, Jong Kyung Yang, and Ju Ung Jo, "Optical and Thermal Influence Analysis of Highpower LED by MCPCB Temperature" trans. KIEE, Vol. 57, No. 12, pp. 2276-2280, 2008.
  8. S. L. Chuang, "Degradation of II-VI Blue-green Semiconductor Lasers" IEEE J. Quant. Elec., Vol. 33, p. 970, 1997. https://doi.org/10.1109/3.585485
  9. 정희석, 유형열, 김정수, 이영주, "LED Chip 열저항 측정을 통한 LED Module 온도 분석" 한국조명․전기설비학회 2009 춘계학술대회 논문집, pp. 164-167, 2009.