Design & Manufacturing

Korean Society of Die & Mold Engineering (한국금형공학회)
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A cure process modeling of LED encapsulant silicone

LED 패키징용 실리콘의 경화공정 모델링

  • Song, Min-Jae (Molding & Forming Technology R&D Group, KITECH, Graduate School, Korea Univ.) ;
  • Kim, Heung-Kyu (Molding & Forming Technology R&D Group, KITECH) ;
  • Kang, Jeong Jin (Advanced Convergent Technology R&D Group. KITECH) ;
  • Kim, won-Hee (Department of Mechanical Engineering, Korea Univ.)
  • 송민재 (한국생산기술연구원 금형.성형연구그룹, 고려대학교 대학원) ;
  • 김흥규 (한국생산기술연구원 금형.성형연구그룹) ;
  • 강정진 (한국생산기술연구원 미래융합연구그룹) ;
  • 김권희 (고려대학교 기계공학부)
  • Received : 2011.12.06
  • Accepted : 2012.04.27
  • Published : 2012.06.29
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Abstract

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

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