Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Fabrication Process and Sensing Characteristics of the In-plane Thermoelectric Sensor Consisting of the Evaporated p-type Sb-Te and n-type Bi-Te Thin Films

n형 Bi-Te와 p형 Sb-Te 증착박막으로 구성된 in-plane 열전센서의 형성공정 및 감지특성

  • Bae, Jae-Man (Department of Materials Science and Engineering, Hongik University) ;
  • Kim, Min-Young (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
  • 배재만 (홍익대학교 공과대학 신소재공학과) ;
  • 김민영 (홍익대학교 공과대학 신소재공학과) ;
  • 오태성 (홍익대학교 공과대학 신소재공학과)
  • Received : 2012.02.06
  • Accepted : 2012.02.24
  • Published : 2012.03.31
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Abstract

An in-plane thermoelectric sensor was processed on a glass substrate by evaporation of the n-type Bi-Te and p-type Sb-Te thin films, and its sensing characteristics were evaluated. The n-type Bi-Te thins film used to fabricate the inplane sensor exhibited a Seebeck coefficient of -165 ${\mu}V$/K and a power factor of $80{\times}10^{-4}W/K^2-m$. The p-type Sb-Te thin film used to fabricate the in-plane sensor exhibited a Seebeck coefficient of 142 ${\mu}V$/K and a power factor of $51.7{\times}10^{-4}W/K^2-m$. The in-plane thermoelectric sensor consisting of 15 pairs of the n-type Bi-Te and the p-type Sb-Te evaporated thin films exhibited a sensitivity of 2.8 mV/K.

유리기판에 n형 Bi-Te 열전박막과 p형 Sb-Te 열전박막을 진공증착하여 in-plane 열전센서를 형성한 후, 열전센서의 감지특성을 분석하였다. 열전센서를 구성하는데 사용한 n형 Bi-Te 증착박막은 -165 ${\mu}V$/K의 Seebeck 계수와 $80{\times}10^{-4}W/K^2-m$의 출력인자를 나타내었으며, p형 Sb-Te 증착박막은 142 ${\mu}V$/K의 Seebeck 계수와 $51.7{\times}10^{-4}W/K^2-m$의 출력인자를 나타내었다. 이와 같은 n형 Bi-Te 및 p형 Sb-Te 박막 15쌍으로 구성된 열전센서는 2.8 mV/K의 감지도를 나타내었다.

Keywords

References

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