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Device Degradation with Gate Lengths and Gate Widths in InGaZnO Thin Film Transistors

게이트 길이와 게이트 폭에 따른 InGaZnO 박막 트랜지스터의 소자 특성 저하

  • Received : 2012.04.30
  • Accepted : 2012.05.16
  • Published : 2012.06.30

Abstract

An InGaZnO thin film transistor with different gate lengths and widths have been fabricated and their device degradations with device sizes have been also performed after negative gate bias stress. The threshold voltage and subthreshold swing have been decreased with decrease of gate length. However, the threshold voltages were increased with the decrease of gate lengths. The transfer curves were negatively shifted after negative gate stress and the threshold voltage was decreased. However, the subthreshold swing was not changed after negative gate stress. This is due to the hole trapping in the gate dielectric materials. The decreases of the threshold voltage variation with the decrease of gate length and the increase of gate width were believed due to the less hole injection into gate dielectrics after a negative gate stress.

게이트 길이와 폭이 다른 InGaZnO 박막 트랜지스터를 제작하고 소자의 크기에 따른 문턱전압과 음의 게이트 전압 스트레스 후의 소자 특성 저하에 관한 연구를 수행하였다. 게이트 길이가 짧은 소자는 문턱전압과 문턱전압 아래의 기울기 역수가 감소하였고 채널 폭이 작은 소자는 문턱전압이 증가 하였다. 음의 게이트 전압 스트레스 후에는 전달특성 곡선이 왼쪽으로 이동하였고 문턱전압은 감소하였으며 문턱전압 아래의 기울기 역수는 변화가 거의 없었다. 이러한 결과는 게이트 유전체에 포획된 홀 때문으로 사료된다. 게이트에 음의 스트레스 전압을 인가한 후에 게이트 길이가 짧을수록 그리고 게이트 폭이 증가할수록 문턱전압의 변화가 적은 것은 홀 주입이 적기 때문으로 사료된다.

Keywords

References

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