Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
권호 표지
DOI QR코드

DOI QR Code

Manufacturing Cost Optimization of Ultrasonic Horn for Flip-chip Bonding using Tolerance Design

공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화

  • Kim, Jong-Hyok (Department of Mechanical Information Engineering, University of Seoul) ;
  • Kwon, Won-Tae (Department of Mechanical Information Engineering, University of Seoul) ;
  • Lee, Soo-Il (Department of Mechanical Information Engineering, University of Seoul)
  • 김종혁 (서울시립대학교 기계정보공학과 대학원) ;
  • 권원태 (서울시립대학교 기계정보공학과) ;
  • 이수일 (서울시립대학교 기계정보공학과)
  • Received : 2011.10.21
  • Accepted : 2012.05.13
  • Published : 2012.08.01
Download PDF
⟨ Previous Next ⟩

Abstract

The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and accuracy is necessary. In this research, an attempt was made to design the ultra sonic horn within acceptable natural frequency while the manufacturing cost was kept as low as possible. For this purpose, among the 18 tolerances of physical terms of the ultrasonic horn, the most important 4 factors were selected using Taguchi method. The equation to relate those main factors and the natural frequency was made using response surface method. Finally, optimal design scheme for minimum manufacturing cost without a loss of performance was determined using SQP method.

Keywords

References

  1. Kang, S. Y., Williams, P. M., McLaren, T. S., and Lee, Y. C., "Studies of thermosonic bonding for flip chip assembly," Materials Chemistry and Physics, Vol. 42, No. 1, pp. 31-37, 1995. https://doi.org/10.1016/0254-0584(95)80039-5
  2. McLaren, T., Kang, S. Y., Zhang, W., Hellman, D., Ju, T. H., and Lee, Y. C., "Thermosonic flip chip bonding for an 8x8 VCSEL array," Proc. 45th ECTC, pp. 393-400, 1995.
  3. Jung, H. K., Kwon, W. T., and Yoon, B. O., "Effect of the Tolerance Parameters of the Horn on the Vibration of the Thermosonic Transverse Bonding Flip Chip System," Transactions of the Korean Society of Machine Tool Engineers, Vol. 18, No. 1, pp. 116-121, 2008.
  4. Choi, M. S. and Lee, D. Y., "Concurrent Optimization of Design and Machining Tolerances with Accumulated Scrap Cost Model(ASCM)," Trans. of the Korean Society of Mechanical Engineers A, Vol. 25, No. 3, pp. 452-460, 2001.
  5. Jung, H. K., Kwon, W. T., Rhee, G. H., Shim, H. S., Jung, J. H., and Lee, H. W., "Effect of the temperature and the tolerance parameter on the horn of the thermosonic bonding system," Proceeding of the KSMTE Spring Conference, pp. 480-485, 2008.
  6. Lee, B. C., Moon, J. H., Kang, Y. S., and Yang, D. Y., "A study on the Formability Estimation of Deep Drawing Process by Using Taguchi Method," J. of KSPE, Vol. 14, No. 11, pp. 17-24, 1997.
  7. Park, J. S., Lee, D. J., and Im, J. B., "The Study for Construction of the Improved Optimization Algorithm by the Response Surface Method," J. of the Korean Society for Aeronautical Science and Flight Operation, Vol. 13, No. 3, pp. 22-33, 2005.
  8. Ha, C. Y., Kim, I. K., and Lee, S. I., "Vibration Analysis and Design of Ultrasonic Horn for Flip-Chip Bonding," Proceeding of the KSPE Spring Conference, pp. 525-526, 2009.
  9. Choi, J. H., Lee, S. J., and Choi, D. H., "Reliability-Based Tolerance Optimization of Mechanisms," Trans. of the Korean Society of Mechanical Engineers A, Vol. 23, No. 5, pp. 751-762, 1999.
  10. Shin, K. C., Kim, C. J., and Kim, D. G., "A Study on a Robust SQP Algorithm for Nonlinear Optimal Control Analysis," Proceeding of the KSAS Spring Conference, pp. 469-474, 2011.
  11. Lee, H. W. and Kwon, W. T., "Global Optimization of the Turning Operation Using Response Surface Method," Journal of the Korean Society of Machine Tool Engineers, Vol. 19, No. 1, pp. 114-120, 2010.
  12. Kim, T. S. and Kim, Y. Y., "Mac-based mode tracking in structural topology optimization," Computers and Structures, Vol. 74, No. 3, pp. 375-383, 2000. https://doi.org/10.1016/S0045-7949(99)00056-5