Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Replication Characteristics of Micro-Patterns according to the Vibration Transmission Direction in the Ultrasonic Imprinting Process

초음파 성형시 진동전달 방향에 따른 미세패턴의 전사특성 고찰

  • Seo, Young-Soo (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology) ;
  • Lee, Ki-Yeon (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology) ;
  • Cho, Young-Hak (Dept. Mechanical System Design Engineering, Seoul National Univ. of Science and Technology) ;
  • Park, Keun (Dept. Mechanical System Design Engineering, Seoul National Univ. of Science and Technology)
  • 서영수 (서울과학기술대학교 NID융합기술대학원) ;
  • 이기연 (서울과학기술대학교 NID융합기술대학원) ;
  • 조영학 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 박근 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2012.04.16
  • Accepted : 2012.08.28
  • Published : 2012.11.01
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Abstract

The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

Keywords

References

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