Korean Journal of Optics and Photonics (한국광학회지)

Optical Society of Korea (한국광학회)
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Heat Conduction Analysis of Metal Hybrid Die Adhesive Structure for High Power LED Package

고출력 LED 패키지의 열 전달 개선을 위한 금속-실리콘 병렬 접합 구조의 특성 분석

  • Yim, Hae-Dong (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) ;
  • Choi, Bong-Man (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) ;
  • Lee, Dong-Jin (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) ;
  • Lee, Seung-Gol (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) ;
  • Park, Se-Geun (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) ;
  • O, Beom-Hoan (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
  • 임해동 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR)) ;
  • 최봉만 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR)) ;
  • 이동진 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR)) ;
  • 이승걸 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR)) ;
  • 박세근 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR)) ;
  • 오범환 (인하대학교 정보통신공학과 고성능 LED 조명모듈 핵심기술 연구센터(LED-STAR))
  • Received : 2013.09.26
  • Accepted : 2013.11.27
  • Published : 2013.12.25
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Abstract

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

고출력 LED 패키지의 방열 특성 향상을 위하여, 다이 접합부에 실리콘 접착제와 금속 패턴의 병렬 접합 구조를 적용하여 열 유동 해석을 수행하였다. 그 결과, LED 칩에서 발생한 열은 주로 금속 패턴 구조물을 통해 기판으로 효과적으로 전달되고 있으나, 패턴 구조물의 크기에 따라 효율의 차이가 있음을 확인하였고, 그 효과를 정량화하기 위해 정규화 길이를 도입하여 칩과 금속 패턴 구조물의 면적에 따른 열 저항을 비교하였다. 정규화 길이가 길어지면 금속 패턴 구조물에 의한 열 우회 경로가 칩에 고르게 분포하여 열 저항이 감소하였으며, 그 값은 단순 병렬 열 저항 이론 값보다 다소 큰 수치로 수렴하지만, 충분한 열 저항 개선 효과를 얻을 수 있었다.

Keywords

References

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