한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제22권1호
  • /
  • Pages.15-21
  • /
  • 2013
  • /
  • 2508-5093(pISSN)
  • /
  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
권호 표지
DOI QR코드

DOI QR Code

마이크로 원형 모세관에서 계면 이동 현상의 측정

Measurements of Flow Meniscus Movement in a Micro Capillary Tube

  • 이석종 (서울과학기술대학교 에너지환경대학원) ;
  • 성재용 (서울과학기술대학교 기계자동차공학과) ;
  • 이명호 (서울과학기술대학교 기계자동차공학과)
  • 투고 : 2012.09.11
  • 심사 : 2013.01.30
  • 발행 : 2013.02.15
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this paper, a high-speed imaging and an image processing technique have been applied to detect the position of a meniscus as a function of time in the micro capillary flows. Two fluids with low and high viscosities, ethylene glycol and glycerin, were dropped into the entrance well of a circular capillary tube. The filling times of the meniscus in both cases of ethylene glycol and glycerin were compared with the theoretical models - Washburn model and its modified model based on Newman's dynamic contact angle equation. To evaluate the model coefficients of Newman's dynamic contact angle, time-varying contact angles under the capillary flows were measured using an image processing technique. By considering the dynamic contact angle, the estimated filling time from the modified Washburn model agrees well with the experimental data. Especially, for the lower-viscosity fluid, the consideration of dynamic contact angle is more significant than for the higher-viscosity fluid.

키워드

참고문헌

  1. Washburn, E. W., 1921, "The Dynamic of Capillary Flow," Phys. Rev., Vol. 17, pp. 273-283. https://doi.org/10.1103/PhysRev.17.273
  2. Newman, S., 1968, "Kinetics of Wetting of Surfaces by Polymers; Capillary Flow," J. Colloid Interface Sci., Vol. 26, No. 2, pp. 209-213. https://doi.org/10.1016/0021-9797(68)90313-5
  3. Suryanarayana, D., Hsiao, R., Gall, T. P., and McCreary, J. M., 1991, "Enhancement of Flip-chip Fatigue Life by Encapsulation," IEEE Comp., Hybrids Manufacturing Technology, Vol. 14, No. 1, pp. 218-223. https://doi.org/10.1109/33.76536
  4. Schwiebert, M. K., and Leong, W. H., 1996, "Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action," IEEE Trans. Components, Packaging, and Manufacturing Technology, Vol. 19, No. 12, pp. 133-137. https://doi.org/10.1109/3476.507149
  5. Han, S., and Wang, K. K., 1997, "Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-chips," IEEE Tran. Components, Packaging, and Manufacturing Technology, Vol. 20, No. 4, pp. 424-433. https://doi.org/10.1109/96.641511
  6. Young, W. B., and Yang, W. L., 2002, "The Effect of Solder Bump Pitch on the Underfill Flow," IEEE Trans. Advanced Packaging, Vol. 25, No. 4, pp. 537-542. https://doi.org/10.1109/TADVP.2002.807564
  7. Wang, J., 2002, "Underfill of Flip Chip on Organic Substrate: Viscosity, Surface Tension, and Contact Angle," Microelectronics Reliability, Vol. 42, No. 2, pp. 293-299. https://doi.org/10.1016/S0026-2714(01)00231-1
  8. Wan, J. W., Zhang, W. J., and Bergstrom, D. J., 2005, "An Analytical Model for Predicting the Underfill Flow Characteristics in Flip-chip Encapsulation," IEEE Trans. Advanced Packaging, Vol. 28, No. 3, pp. 481-487. https://doi.org/10.1109/TADVP.2005.848385
  9. Yin, B. Y. W., 2007, "Designing Underfill Material in Resolving Package High Coplanarity Issues," 9th Electronics Packaging Technology Conference, pp. 636-639.
  10. Ho, P. S., Xiong, Z. P., and Chua, K. H., 2007, "Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-die Flip Chip Ball Grid Array (FCBGA) Package," 9th Electronics Packaging Technology Conference, pp. 640-645.
  11. Wan, J. W., Zhang, W. J. ,and Bergstrom, D. J., 2008, "Experimental Verification of Models for Underfill Flow Driven by Capillary Forces in Flip-chip Packaging", Microelectronics Reliability, Vol. 48, No. 3, pp. 425-430. https://doi.org/10.1016/j.microrel.2007.06.006