Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Laser Cutting of Flexible Printed Circuit Board in Liquid

연성인쇄회로기판의 액중 레이저 절단

  • 김택구 (서울과학대학교 NID 융합기술 대학원) ;
  • 김주한 (서울과학기술대학교 기계.자동차공학과)
  • Received : 2012.07.24
  • Accepted : 2012.10.22
  • Published : 2013.02.15
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Abstract

The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

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References

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