Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Numerical Analysis of Pressure and Temperature Effects on Residual Layer Formation in Thermal Nanoimprint Lithography

  • Lee, Ki Yeon (Department of Mechanical Engineering, Soonchunhyang University) ;
  • Kim, Kug Weon (Department of Mechanical Engineering, Soonchunhyang University)
  • Received : 2013.06.03
  • Accepted : 2013.06.17
  • Published : 2013.06.30
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Abstract

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. To successfully imprint a nanosized pattern with the thermal NIL, the process conditions such as temperature and pressure should be appropriately selected. This starts with a clear understanding of polymer material behavior during the thermal NIL process. In this paper, a filling process of the polymer resist into nanometer scale cavities during the thermal NIL at the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer. In the simulation, the filling process and the residual layer formation are numerically investigated. And the effects of pressure and temperature on NIL process, specially the residual layer formation are discussed.

Keywords

References

  1. Chou, S. and Krauss, P., "Imprint Lithography with Sub10 nm Feature Size and High Throughput," Microelectronic Engineering, Vol. 35, pp. 237-240, 1997. https://doi.org/10.1016/S0167-9317(96)00097-4
  2. Guo, L.J. "Recent Progress in Nanoimprint Technology and Its Applications," Journal of Physics D: Applied Physics, Vol.37, pp. R123-R142, 2004. https://doi.org/10.1088/0022-3727/37/11/R01
  3. Hirai, Y., Fujiwara, M., Okuno, T., Tanaka, Y.,Endo, M., Irie, S., Nakagawa K. and Sasago M., "Study of the Resist Deformation in Nanoimprint Lithography," J. Vac. Sci. Technol. B,Vol. 19, pp. 2811-2815,2001. https://doi.org/10.1116/1.1415510
  4. Hirai, Y., Konish, T., Yoshikawa, T. and Yoshida,S., "Simulation and Experimental Study of Polymer Deformation in Nanoimprint Lithography," J. Vac. Sci. Technol. B, Vol. 22, pp. 3288-3293, 2004. https://doi.org/10.1116/1.1826058
  5. Kim, N.W., Kim, K.W. and Sin, H.-C., "A Viscoelasitc Finite Element Analysis of Thermal Nanoimprint Lithography Process," Journal of the Microelectronics &Packaging Society, Vol. 14, No.4, pp. 1-7, 2007.
  6. Kim, N.W., Kim, K.W. and Sin, H.-C.,"Effect of Pressure and Initial Polymer Resist Thickness on Low Temperature Nanoimprint Lithography," Journal of manufacturing engineering & technology, Vol. 18, No. 1, pp.68-75, 2009.
  7. Kim, N.W., Kim, K.W. and Sin, H.-C., "Finite Element Analysis of Low Temperature Thermal Nanoimprint Lithography Using a Viscoelastic Model," Microelectronic Engineering, Vol.85, pp. 1858-1865, 2008. https://doi.org/10.1016/j.mee.2008.05.030
  8. Kim, N.W., Kim, K.W. and Sin, H.-C.,"A Mathematical Model for Slip Phenomenon in a Cavity-Filling Process of Nanoimprint Lithography," Microelectronic Engineering, Vol.86, pp. 2324-2329, 2009. https://doi.org/10.1016/j.mee.2009.04.011
  9. Christensen,R.M., Theory of Viscoelasticity: An Introduction, Academic Press, New York, 1971.
  10. Zichao Song, "Study of Demolding Process in Thermal Imprint Lithography via Numerical Simulation and Experimental Approaches," M.S. Thesis, Louisiana State University, 2007.
  11. ABAQUS Ver. 6.8, Dassault Systems, "www.3ds.com", 2008.