Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지
DOI QR코드

DOI QR Code

Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module

자동차 전장모듈대응을 위한 Sn3.5Ag와 Sn0.7Cu 솔더 접합부의 물리적 특성 및 복합진동을 통한 신뢰성 평가 - 자동차 전장모듈의 접합 신뢰성 연구 (II)-

  • Ko, Young-Ho (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Bang, Jung-Hwan (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Kim, Jeong-Han (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Lee, Chang-Woo (Microjoining Center, Korea Institute of Industrial Technology)
  • 고용호 (한국생산기술연구원 마이크로조이닝센터) ;
  • 방정환 (한국생산기술연구원 마이크로조이닝센터) ;
  • 김정한 (한국생산기술연구원 마이크로조이닝센터) ;
  • 이창우 (한국생산기술연구원 마이크로조이닝센터)
  • Published : 2013.02.28
Download PDF
⟨ Previous Next ⟩

Abstract

Keywords

References

  1. Y. K. Jee, Y. H. Ko, and J. Yu, J. Mater. Res., "Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints", J. Mater. Res., 22(10) (2007), 1879 https://doi.org/10.1557/jmr.2007.0234
  2. B. I. Noh, S. H. Won, and S. B. Jung, "Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder", J. Microelectron. Packag. Soc., 14(4) (2007), 21
  3. R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thompson, and M. Christopher, "The Changing Automotive Environment: High-Temperature Electronics", IEEE Trans. Electron. Package. Manufac. 27(3) (2004), 164 https://doi.org/10.1109/TEPM.2004.843109
  4. J. H. Choi, S. W. Jun, H. J. Won, B. Y. Jung, and T. S. Oh, "Electromigration Behavior of the Flip-Chip Bonded Sn-3.5Ag-0.5Cu Solder Bumps", J. Microelectron. Packag. Soc., 11(4) (2004), 43
  5. Y. S. Chen, C. S. Wang, and Y. J. Yang, "Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components", Microelectron. Reliab., 48 (2008), 638 https://doi.org/10.1016/j.microrel.2007.11.006
  6. J. M. Song, T. S. Lui, G. F. Lan, and L. H. Chen, "Resonant vibration behavior of Sn-Zn-Ag solder alloys", J. Alloy. Compd., 379 (2004)
  7. F. X. Che and John H. L. Pang, "Vibration reliability test and finite element analysis for flip chip solder joints", Microelectron. Reliab., 49, 754 (2009) https://doi.org/10.1016/j.microrel.2009.03.022
  8. S. K. KANG, W. K. CHOI, M. J. YIM, and D. Y. SHIH, "Studies of the Mechanical and Electrical Properties of Lead-Free Solder Joints", J. Electron. Mater., 31(11) (2002), 1292 https://doi.org/10.1007/s11664-002-0023-9
  9. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K.N. Tu, "Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test", Scripta Materialia, 51 (2004), 641 https://doi.org/10.1016/j.scriptamat.2004.06.027