Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions

Bendable 임베디드 전자모듈의 손상 메커니즘

  • Jo, Yun-Seong (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Kim, A Young (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Hong, Won Sik (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
  • 조윤성 (전자부품연구원 부품소재물리연구센터) ;
  • 김아영 (전자부품연구원 부품소재물리연구센터) ;
  • 홍원식 (전자부품연구원 부품소재물리연구센터)
  • Received : 2013.09.17
  • Accepted : 2013.10.07
  • Published : 2013.10.31
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Abstract

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

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References

  1. G.H. Wang, Y.S. Cho, S.T. Hong, J.G. Kim, W.S. Choi, J.D. Kim, J.C. Ryu, W.S. Hong and C.M. Oh : Active-Device-Embedded of Bendable Electronic Module, 12th International Conference on Electronic Materials and Packaging, Singapore, Oct. (2010)
  2. D.G. Kim, S.T. Hong, D.H. Kim, W.S. Hong and C.W. Lee : Fabrication and Reliability Test of Device Embedded Flexible Module, Journal of KWS, 31-3 (2013), 84-88 (in Korean) https://doi.org/10.5781/KWJS.2013.31.3.84
  3. W.S. Hong and C.M. Oh : PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development, Journal of KWS, 27-3 (2009), 10-16 (in Korean) https://doi.org/10.5781/KWJS.2009.27.3.010
  4. S.S. Yoon, Z.Y. Wang and B.T. Han : On Moisture Diffusion Modeling Using Thermal-Moisture Analogy, ASME Journal of Electronic Packaging, 129 (2007), 421-426 https://doi.org/10.1115/1.2804090
  5. C.S. Jang, B.T. Han, S.S. Yoon and S.B. Park : Advanced Thermal-Moisture Analogy Scheme Anisothermal Moisture Diffusion Problem, ASME Journal of Electronic Packaging, 130 (2008), 011004.1-011004.8
  6. W.S. Hong, C.M. Oh, C.W. Han, G.H. Wang, S.T. Hong and J.D. Kim : Moisture Diffusion Coefficient and Activation Energy of Adhesive Film for Flexible Embedded Electronic Module, 12th International Conference on Electronic Materials and Packaging (EMAP 2010), Singapore, Oct (2010)
  7. T. Ikeda, W.K. Kim and N. Miyazaki : Evaluation of the Delamination in a Flip chip Using Anisotropic Conductive Adhesive Films Under Moisture/reflow Sensitivity Test, IEEE Transactions on Components and Packaging Technologies, 29-3 (2006), 551-559 https://doi.org/10.1109/TCAPT.2006.880510
  8. M.G. Penon, S.J. Picken, M. Wübbenhorst, G. de Vos, J and Van Turnhout : Dielectric Water Sorption Analysis, Review of Scientific Instruments, 77-11 (2006), 115107.1-115107.6
  9. C.W. Han, C.M. Oh and W.S. Hong : Moisture Diffusion Analysis for Bendable Electronic Module Under Autoclave Test Condition, Journals of Mechanical Science and Technology, 36-5 (2012), 523-528 (in Korean) https://doi.org/10.3795/KSME-A.2012.36.5.523
  10. J. E. Galloway and B. M. Miles : Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages, IEEE Transaction on Packaging and Manufacturing Technology-Part A, 20-3 (1997), 274-279 https://doi.org/10.1109/95.623021
  11. W.J. Cantwell and J. Morton, b : The impact resistance of composite materials -- a review. Composites, 22-5 (1991), 347-362 https://doi.org/10.1016/0010-4361(91)90549-V
  12. E.H. Wong, K.C. Chan, R. Rajoo and T.B. Lim : The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging, Electronic Components and Technology Conference 2000, (2000), 576-580
  13. J.R. Branco, J.A. Ferreira and P. da Silva : Non- Fickian delay reaction-diffusion equations: Theoretical and numerical study, Applied Numerical Mathematics, 60 (2010), 531-549 https://doi.org/10.1016/j.apnum.2010.01.003
  14. S.S. Yoon, C.S. Jang and B.T. Han : Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading, ASME Journal of Electronic Packaging, 130-2 (2008), 024502-1-024502-5 https://doi.org/10.1115/1.2912181
  15. J.H. Yoon and Y.E. Shin : A prediction of the thermal fatigue life of solder joint in IC package for surface mount, Journal of KWS, 16-4 (1998), 348- 353 (in Korean)