Abstract
We investigated the optimal etching conditions and properties of the surface change due to molten KOH/NaOH chemical wet etching using an AlN wafer which has been put to practical use in the present study. Results were observed using a scanning electron microscope after 5 minutes etching at $350^{\circ}C$, was found to have a surface form of the respective other Al-face, the N-face. In particular, etch-pit in the form of a hexagon, which is observed in the Al-face appeared, It was calculated at $2{\times}10^6/cm^2{\sim}10^{10}/cm^2$ dislocation density. In the case of N-face, lattice defects in the form of the hexagonal pyramids is formed. It was discovered that in order to observe the orientation of the wafer, which corresponds to the C-axis direction of the resulting hexagonal AlN which was analyzed using XRD (0002) and is a state of being oriented in the (0004) plane. The Radius of curvature of AlN wafer was 1.6~17 m measured by DC-XRD rocking curve position.
본 연구에서는 상용화되는 AlN 웨이퍼(wafer)를 이용하여 molten KOH/NaOH 화학적 습식 에칭(Wet Chemical Etching)에 따른 표면변화 특성 및 최적의 에칭 조건을 조사하였다. AlN 웨이퍼를 $350^{\circ}C$에서 5분간 에칭 시 Al-face, N-face는 서로 다른 관찰되었다. 특히, Al-face는 에치핏의 형상을 파악하여 결함특성을 관찰하였고, 이로부터 결함 밀도를 계산하여 $2{\times}10^6/cm^2{\sim}10^{10}/cm^2$의 결과를 얻었다. N-face의 경우 육각 뿔(hexagonal pyramids) 형태의 격자결함이 형성되었다. 또한 AlN 웨이퍼의 성장 시 배향을 관찰하기 위해 XRD(X-Ray Diffraction, Rigaku, JAPAN)를 이용하여 분석한 결과 육방정 AlN의 C축 방향에 해당되는 (0002) 및 (0004) 면으로 배향된 상태임을 알 수 있었고, DC-XRD(Double Crystal X-ray Diffraction, bruker, Germany)를 이용하여 rocking curve의 위치에 따라 곡률 반경을 측정했을 때 1.6~17 m의 곡률을 가지고 있는 것으로 나타났다.
