Effects of Forced Self Driving Function in Silicon Wafer Polishing Head on the Planarization of Polished Wafer Surfaces

실리콘 웨이퍼 연마헤드의 강제구동 방식이 웨이퍼 연마 평탄도에 미치는 영향 연구

  • Kim, Kyoungjin (Department of Mechanical System Engineering, Kumoh National Institute of Technology) ;
  • Park, Joong-Youn (Department of Mechatronics, Kumoh National Institute of Technology)
  • 김경진 (금오공과대학교 기계시스템공학과) ;
  • 박중윤 (금오공과대학교 기전공학과)
  • Received : 2014.01.03
  • Accepted : 2014.02.28
  • Published : 2014.03.31

Abstract

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

Keywords

Acknowledgement

Supported by : 금오공과대학교

References

  1. Pei, Z. J., Fisher, G. R., and Liu, J., "Grinding of Silicon Wafers: A View from Historical Perspectives," International Journal of Machine Tools and Manufacture, Vol. 48, pp. 1297-1307, 2008. https://doi.org/10.1016/j.ijmachtools.2008.05.009
  2. Sun, W., Pei, Z. J., Fisher, and G. R., "Fine Grinding of Silicon Wafers: Effects of Chuck Shape on Grinding Marks," International Journal of Machine Tools and Manufacture, Vol. 45, pp. 673-686, 2005. https://doi.org/10.1016/j.ijmachtools.2004.09.020
  3. Kim, K., Kwak, H. S., and Park, K. S., "An Experimental Study on Wafer Demounting by Water Jet in a Waxless Silicon Wafer Mounting System," Journal of the Semiconductor & Display Equipment Technology, Vol. 8, pp. 31-35, 2009.
  4. Kim, K., Kim, D., and Park, J.-Y., "CFD Analysis on the Internal Air Flow Control in a Wax Spin Coater of Silicon Wafer Polishing Station," Journal of the Semiconductor & Display Technology, Vol. 10, pp. 1-6, 2010. https://doi.org/10.5573/JSTS.2010.10.1.001
  5. Larson, R. G. and Rehg, T. J., "Spin Coating," Liquid Film Coating, edited by Kistler, S. F. and Schweizer, P. M., Chapman & Hill, London, pp. 709-734, 1997.
  6. Noh, Y. M., Im, I. T., and Kim, K. S., "A Numerical Study on Combined Solution and Evaporation during Spin Coating," Journal of The Korean Society of Semiconductor & Display Equipment Technology, Vol. 2, pp. 25-29, 2003.
  7. Shih, S., Au, C., Yang, Z., Messina, T., Goodall, R. K., and Huff, H. R., "Characterization of 300 mm Silicon- Polished and EPI Wafers," Microelectronic Engineering, Vol. 45, pp. 169-182, 1999. https://doi.org/10.1016/S0167-9317(99)00134-3