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Effects of Acceleration and Deceleration Parameters on the Machining Error for Large Area Laser Processing

대면적 레이저 가공을 위한 가감속 파라미터가 가공오차에 미치는 영향

  • Lee, Jae Hoon (Department of Laser & Electron-beam Application, Korea Institute of Machinery & Materials) ;
  • Yoon, Kwang Ho (Department of Laser & Electron-beam Application, Korea Institute of Machinery & Materials) ;
  • Kim, Kyung Han (Department of Laser & Electron-beam Application, Korea Institute of Machinery & Materials)
  • 이제훈 (한국기계연구원 광응용기계연구실) ;
  • 윤광호 (한국기계연구원 광응용기계연구실) ;
  • 김경한 (한국기계연구원 광응용기계연구실)
  • Received : 2014.01.14
  • Accepted : 2014.07.03
  • Published : 2014.08.01

Abstract

In this paper, it is proposed a method of optimizing path parameters for large-area laser processing. On-the-fly system is necessary for large-area laser processing of uniform quality. It is developed a MOTF(Marking On-The-Fly) board for synchronizing the stage and scanner. And it is introduced the change of the error due to the change of parameters and algorithm for large-area laser processing. This algorithm automatically generates stage path and a velocity profile using acceleration and deceleration parameters. Since this method doesn't use a G-code, even if without expert knowledge, it has an advantage that can be accessed easily. Angle of one of the square of $350{\times}350mm$ was changed from $50^{\circ}$ to $80^{\circ}$ and analyzed the error corresponding to the value of Ta. It is calculated the value of Ta of the best with a precision of 20um through measurement of accuracy according to the Ta of each angle near the edge.

Keywords

References

  1. Kyeong, D., Gunasekaran, M., Kim, K., Kim, H., Kwon, T., et al., "Laser Edge Isolation for High- Efficiency Crystalline Silicon Solar Cells," Journal of Korean Physical Society, Vol. 55, No. 1, Paper No. 124, 2009. https://doi.org/10.3938/jkps.55.124
  2. Shin, D., Lee, J., Sohn, H., Noh, J., and Paik, B., "A FPCB Cutting Process using a Picosecond Laser," Journal of Laser Micro/Nanoeng, Vol. 5, No. 1, pp. 48-52, 2010. https://doi.org/10.2961/jlmn.2010.01.0011
  3. Kim, K. H., Lee, J. H., and Suh, J., "Laser Scanner Stage on the Fly Technique for High Precision/Ultra-Fast/Wide Area Fabrication," Proc. of KSME Spring Conference, pp. 31-32, 2010.
  4. Yoon, K. H., Lee, J. H., Kim K. H., and Suh, J., "Scanner-Stage Synchronization Control Method for Laser Fabrication of Large Aera," Proc. of KSME Spring Conference, pp. 287-288, 2010.
  5. Kim, K. H., Lee, J. H., Suh, J., and Yoon, K. H., "The Scanner-Stage on the Fly Technology for a Ultra Precision/Ultrafast/Wide Area Fabrication," Proc. of KSLP Spring Conference, pp. 44-46, 2010.
  6. Lee, J. H. and Kim, K. H., "Core Technology for Ultra Fast/Wide Area Laser Processing," Machinery and Materials, Vol. 22, No. 1, pp. 36-42, 2010.
  7. Kim, K. H., Lee, J. H., and Yoon, K. H., "Path Generation Algorithm Development for Ultrafast/Wide Area Laser Processing, J. Korean Soc. Precis. Eng., Vol. 27, No. 10, pp. 34-39, 2010.
  8. Yoon, K., Kim, K., and Lee, J., "Continuous Laser Fabrication Method using Adaptive Cell Decomposition," Journal of Laser Micro/ Nanoengineering, Vol. 7, No. 2, pp. 226-230, 2012. https://doi.org/10.2961/jlmn.2012.02.0017
  9. Kim, K., Yoon, K., Suh, J., and Lee, J., "Laser Scanner-Stage Synchronization Method for High- Speed and Wide-Area Fabrication," Journal of Laser Micro/Nanoengineering, Vol. 7, No. 2, pp. 231-235, 2012. https://doi.org/10.2961/jlmn.2012.02.0018
  10. ESI, "Model 5335 Laser Processing System," http://www.esi.com/Products/InterconnectMicrofabrication/Interconnect/5335/tabid/432/tid/230/Default.aspx (Accessed 16 July 2014)
  11. LPKF, "LPKF MicroLine 6000 P," http://www.lpkf.com/ products/pcb-processing/microline-6000p.htm (Accessed 16 July 2014)
  12. AEROTECH, "Laser Processing," http://www.aerotech.com/industries-and-applications/laser-processing.-aspx (Accessed 16 July 2014)