마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제21권2호
  • /
  • Pages.13-21
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  • 2014
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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파워디바이스 패키징의 열제어 기술과 연구 동향

Overview on Thermal Management Technology for High Power Device Packaging

  • 김광석 (성균관대학교 나노과학기술학과) ;
  • 최돈현 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • 투고 : 2014.06.12
  • 심사 : 2014.06.19
  • 발행 : 2014.06.30
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초록

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

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참고문헌

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피인용 문헌

  1. Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications vol.21, pp.4, 2014, https://doi.org/10.6117/kmeps.2014.21.4.001
  2. Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding vol.16, pp.5, 2014, https://doi.org/10.6113/jpe.2016.16.5.1843