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Temporary Bonding and Debonding 공정용 UV 경화형 접착 소재의 코팅 두께에 따른 물성 및 경화거동

Properties and Curing Behaviors of UV Curable Adhesives with Different Coating Thickness in Temporary Bonding and Debonding Process

  • 이승우 (서울대학교 접착과학 및 바이오복합재료 연구실) ;
  • 이태형 (서울대학교 접착과학 및 바이오복합재료 연구실) ;
  • 박지원 (서울대학교 접착과학 및 바이오복합재료 연구실) ;
  • 박초희 (서울대학교 접착과학 및 바이오복합재료 연구실) ;
  • 김현중 (서울대학교 접착과학 및 바이오복합재료 연구실)
  • Lee, Seung-Woo (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University) ;
  • Lee, Tae-Hyung (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University) ;
  • Park, Ji-Won (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University) ;
  • Park, Cho-Hee (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University) ;
  • Kim, Hyun-Joong (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
  • 투고 : 2014.08.27
  • 심사 : 2014.09.22
  • 발행 : 2014.10.01

초록

UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

키워드

참고문헌

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