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Numerical Analysis of Micro-pattern Filling with Gas Dissolution by Injection Molding Process

가스 용해를 고려한 금형내압제어 사출성형공정의 마이크로패턴 충전 해석

  • Park, Sung Ho (Department of Mechanical & Aerospace Engineering, Seoul National University) ;
  • Yoo, Hyeong Min (Department of Mechanical & Aerospace Engineering, Seoul National University) ;
  • Lee, Woo Il (Department of Mechanical & Aerospace Engineering, Seoul National University)
  • 박성호 (서울대학교 기계항공공학부) ;
  • 유형민 (서울대학교 기계항공공학부) ;
  • 이우일 (서울대학교 기계항공공학부)
  • Received : 2014.07.25
  • Accepted : 2014.08.29
  • Published : 2014.08.31

Abstract

The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

Keywords

References

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