Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Basic Research For The 3DCD (3D Circuit Devices)

3DCD (3D Circuit Devices) 개발을 위한 기초 연구

  • Yun, Hae Yong (Department of Mechanical system Engineering, Andong University) ;
  • Kim, Ho Chan (Department of Mechanical and Automotive Engineering, Andong University)
  • 윤해룡 (안동대학교 기계시스템공학과) ;
  • 김호찬 (안동대학교 기계자동차공학과, 신뢰성 교육센터)
  • Received : 2014.09.23
  • Accepted : 2014.11.18
  • Published : 2014.12.01
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Abstract

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

Keywords

References

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