Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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3-Dimensional Circuit Device Fabrication for Improved Design Freedom based on the Additive Manufacturing

설계자유도 향상을 위한 부가가공 기반의 3차원 회로장치 제작

  • Oh, Sung Taek (Department of Precision Mechanical Engineering, Chungbuk National University) ;
  • Jang, Sung Hyun (Gumi Electronics and Information Technology Research Institute) ;
  • Lee, In Hwan (School of Mechanical Engineering, Chungbuk National University) ;
  • Kim, Ho Chan (Department of Mechanical & Automotive Engineering, Andong National University) ;
  • Cho, Hae Yong (School of Mechanical Engineering, Chungbuk National University)
  • Received : 2014.09.22
  • Accepted : 2014.10.13
  • Published : 2014.12.01
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Abstract

Multi-material Additive Manufacturing (AM) is being focused to apply for direct manufacturing of a product. In this paper, a three-dimensional circuit device (3DCD) fabrication technology based on the multi-material AM technology was proposed. In contrast with conventional two-dimensional Printed Circuit Board (PCB), circuit elements and conducting wires of 3DCD are placed in threedimensional configuration at multiple layers of the structure. Therefore, 3DCD technology can improve design freedom of an electronic product. In this paper, 3DCD technology is proposed based on AM technology. Two types of 3DCD fabrication systems were developed based on the Stereolithography and the Fused Deposition Modeling technologies. And the 3DCD samples which have same function were fabricated, successfully.

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References

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