Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
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Joining Properties of CoSb3/Al/Ti/CuMo by Spark Plasma Sintering Process

방전플라즈마 소결 공정을 이용한 CoSb3/Al/Ti/CuMo 접합 특성

  • Kim, Min Suk (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Ahn, Jong Pil (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Kyoung Hun (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Kyung Ja (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Park, Joo Seok (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Seo, Won Seon (Business Cooperation Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyung Sun (School of Materials Engineering, Inha University)
  • 김민숙 (한국세라믹기술원 기업협력센터) ;
  • 안종필 (한국세라믹기술원 기업협력센터) ;
  • 김경훈 (한국세라믹기술원 기업협력센터) ;
  • 김경자 (한국세라믹기술원 기업협력센터) ;
  • 박주석 (한국세라믹기술원 기업협력센터) ;
  • 서원선 (한국세라믹기술원 기업협력센터) ;
  • 김형순 (인하대학교 신소재공학과)
  • Received : 2014.10.06
  • Accepted : 2014.11.21
  • Published : 2014.11.30
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Abstract

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

Keywords

References

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  1. Interaction of Skutterudites with Contact Materials: A Metallurgical Analysis vol.41, pp.4, 2014, https://doi.org/10.1007/s11669-020-00799-0