Debonding Technologies and Application of Adhesive for Semiconductor Packaging Process

반도체 패키징 공정용 Debonding 기술 및 접착소재의 응용

Lee, Seung-Woo (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
Park, Cho-Hee (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
Park, Ji-Won (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
Lim, Dong-Hyuk (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University) ;
Song, Jun-Yeob (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
Lee, Jae-Hak (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
Kim, Seung-Man (Department of Ultra Precision Machines and Systems, Korea Institute of Machinery & Materials) ;
Kim, Hyun-Joong (Lab. of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Seoul National University)