References
- T. K. Lee, T. Bieler, C. U. Kim and H. Ma, "Fundamental of solder and interconnect technology", Springer, Chapter, 5, 132 (2014).
- J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim and C. W. Lee, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications", J. Microelectron. Packag. Soc., 21(4), 1 (2014). https://doi.org/10.6117/kmeps.2014.21.4.001
- T. K. Lee, B. Zhou and T. R. Bieler, "Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects", IEEE Transactions on Components and Packaging Technologies (CPMT), 2(3), 496 (2012).
- T. K. Lee, B.e Zhou, L. Blair, K. C. Liu and T. R. Bieler, "Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using Orientation Imaging Microscopy", Journal of Electronic Materials, 39(12), 2588 (2010). https://doi.org/10.1007/s11664-010-1348-4
- T. K. Lee, K. C. Liu and T. R. Bieler, "Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints", Journal of Electronic Materials, 38(12), 2685 (2009). https://doi.org/10.1007/s11664-009-0873-5
- B. Zhou, T. R. Bieler, G. Wu, S. Zaefferer, T. K. Lee and K. C. Liu, "In-Situ Synchrotron Characterization of Melting, Dissolution and Resolidification in Lead-Free Solders", Journal of Electronic Materials, 41(2), 262 (2012). https://doi.org/10.1007/s11664-011-1785-8
- S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka and K. Tatsumi, "Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio's Wafer-Level Packages Based on Morphology and Grain Boundary Character", Journal of Electronic Materials, 38(1), 33 (2009). https://doi.org/10.1007/s11664-008-0560-y
- J. Li, T. T. Mattila and J. K. Kivilahti, "Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling", Journal of Electronic Materials, 39(1), 77 (2010). https://doi.org/10.1007/s11664-009-0957-2
- T. T. Mattila and J. K. Kivilahti, "The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading", IEEE Transactions on Component and Packaging Technologies, 33(3), 629 (2010). https://doi.org/10.1109/TCAPT.2010.2051268
- S. H. Kim, J. M. Kim, S. H. Yoo and Y. B. Park, "Effects of PCB Surface Finishes on Mechanical Reliability of Sn-1.2Ag-0.7Cu-0.4In Pb-free Solder Joint", J. Microelectron. Packag. Soc., 19(4), 57 (2012). https://doi.org/10.6117/kmeps.2012.19.4.057
- JEDEC Standard, JESD22-A104D, Thermal cycling, March 2009, http://www.jedec.org/standards-documents