한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제28권6호
  • /
  • Pages.390-395
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  • 2015
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  • 1226-7945(pISSN)
  • /
  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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산화마그네슘 첨가에 따른 나노컴퍼지트의 수명평가

Life Evaluation of Nano-Composites According to the Addition of MgO

  • 신종열 (삼육대학교 카메카트로닉스학과) ;
  • 정인범 (광운대학교 전기공학과) ;
  • 홍진웅 (광운대학교 전기공학과)
  • 투고 : 2015.02.10
  • 심사 : 2015.03.26
  • 발행 : 2015.06.01
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초록

Molded insulation materials are widely used from large electric power transformer apparatus to small electrical machinery and apparatus. In this study, by adding MgO with the average particle of several tens nm and the excellent thermal conductivity into molding material, we improved the problem of insulation breakdown strength decrease according to rising temperature in overload or in bad environmental condition. We confirmed the life evaluation by using the insulation breakdown and inverse involution to investigate the electrical characteristics of nano-composites materials. By using a scanning electron microscope, it is confirmed that MgO power with the average particle size of several tens nm is distributed and the filler particles is uniformly distributed in the cross section of specimens. And it is confirmed that the insulation breakdown strength of Virgin specimens is rapidly decreased at the high temperature area. But it is confirmed that the insulation breakdown strength of specimens added MgO slow decreased by thermal properties in the high temperature area improved by the contribution of the heat radiation of MgO and the suppression of tree. The results of life prediction using inverse involution, it is confirmed that the life of nano-composites is improved by contribution of MgO according to the predicted insulation breakdown strength after 10 years of specimens added 5.0 wt% of MgO is increased about 2.9 times at RT, and 4.9 times at $100^{\circ}C$ than Virgin specimen, respectively.

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참고문헌

  1. S. Matsumoto, Trans. on IEEJ, 126-B, 574 (2006).
  2. S. Yamanaka, T. Fukuda, G. Sawa, M. Leda, M. Ito, and T. Seguchi, IEEE Transactions on Dielectric and Elecrical Insulation, 2, 54 (1995). https://doi.org/10.1109/94.368680
  3. T. Tanaka, G. C. Montanari, and R. Mulhaupt, IEEE Transactions on Dielectric and Elecrical Insulation, 11, 763 (2004). https://doi.org/10.1109/TDEI.2004.1349782
  4. J. K. Nelson and Y. Hu, J. Phys. D: Appl. Phys., 38, 213 (2005). https://doi.org/10.1088/0022-3727/38/2/005
  5. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEJ Trans., 126, 84 (2006). https://doi.org/10.1541/ieejias.126.84
  6. K. Y. Lee, K. W. Lee, Y. S. Choi, D. H. Park, and K. J. Lim, IEEE Transactions on Dielectric and Electrical Insulation, 12, 566 (2005). https://doi.org/10.1109/TDEI.2005.1453461
  7. S. Singha and M. J. Thomas, IEEE Transactions on Dielectric and Elecrical Insulation, 15, 12 (2008). https://doi.org/10.1109/T-DEI.2008.4446732
  8. J. H. Lee, K. Y. Rhee, and S. J. Park, Materials Science and Engineering: A, 527, 6838 (2010). https://doi.org/10.1016/j.msea.2010.07.080
  9. S. Okuzumi, Y. Murakami, M. Nagao, Y. Sekiguchi, C. C. Reddy, and Y. Murata, IEEE, Annual Report Conference on Electrical Insulation Dielectric Phenomena, 722 (2008).
  10. H. Hirose, IEEJ Trans., 107-A, 185 (1987).
  11. H. Rosen, ANSI/IEEE Std., 930-1987, 24 (1987).
  12. S. Masuda, S. Okuzumi, R. Kurniant, Y. Murakami, M. Nagao, Y. Murata, and Y. Sekiguchi, IEEE, 2007 Annual Report Conference on Electrical Insulation and Dielectric, 290 (2007).
  13. T. Tanka, IEEE Trans. Dielectric El., 12, 914 (2005). https://doi.org/10.1109/TDEI.2005.1522186